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Revealing the Void Formation Mechanism during Superplastic Deformation of a Fine-Grained Ni-Co-Base Superalloy 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2024, 页码: 6
作者:  Al-Hammadi, Rashad A.;  Zhang, Rui;  Cui, Chuanyong;  Zhou, Zijian;  Zhou, Yizhou
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Superplasticity  Void formation  Ni-Co-based superalloy  Microstructure  
Revealing the Void Formation Mechanism during Superplastic Deformation of a Fine-Grained Ni-Co-Base Superalloy 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2024, 页码: 6
作者:  Al-Hammadi, Rashad A.;  Zhang, Rui;  Cui, Chuanyong;  Zhou, Zijian;  Zhou, Yizhou
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Superplasticity  Void formation  Ni-Co-based superalloy  Microstructure  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：113/0  |  提交时间：2018/06/05
Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Mechanical response of Ti-based bulk metallic glass under plate-impact compression 期刊论文
INTERMETALLICS, 2015, 卷号: 63, 页码: 12-18
作者:  Wang, B. P.;  Wang, L.;  Wang, S.;  Fan, Q. B.;  Xue, Y. F.;  Zhang, H. F.;  Fu, H. M.;  xueyunfei@bit.edu.cn
收藏  |  浏览/下载：105/0  |  提交时间：2016/04/21
Metallic Glasses  Mechanical Properties  Void Formation And Growth  Deformation Map  Free Volume  Microstructure  
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
作者:  F. F. Tian;  Z. Q. Liu
收藏  |  浏览/下载：143/0  |  提交时间：2014/03/14
48sn52in  Imc  Morphology  Orientation Relationship  Ebsd  Interfacial Reactions  Soldering Reaction  Joint Reliability  Void  Formation  Solid-state  Sn  Cu3sn  Alloy  Creep  
Analysis of pore formation at oxide-alloy interfaces - I: Experimental results on FeAl 期刊论文
Oxidation of Metals, 2003, 卷号: 59, 期号: 1-2, 页码: 41-61
作者:  P. Y. Hou;  Y. Niu;  C. Van Lienden
收藏  |  浏览/下载：90/0  |  提交时间：2012/04/14
Al2o3  Fcal  Oxide-metal Interface  Void  High-temperature Oxidation  Oxidation Behavior  Alpha-al2o3 Scales  Cavity Formation  beta-nial+zr  Al Alloys  Growth  Spectrometry