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Thermal shock behaviour and failure mechanism of two-kind Cr coatings on non-planar structure 期刊论文
ENGINEERING FAILURE ANALYSIS, 2022, 卷号: 141, 页码: 12
Authors:  Hu, Ming;  Pan, Mengfei;  Shen, Mingli;  Guo, Cean;  Tang, Yueyang;  Yu, Hangjian
Favorite  |  View/Download：60/0  |  Submit date：2022/10/08
Thermal shock behaviour  Cr coating  Non-planar structure  Electroplating  Vacuum arc ion plating  
Molecular dynamics study on the contribution of anisotropic phonon transmission to thermal conductivity of silicon 期刊论文
JOURNAL OF PHYSICS-CONDENSED MATTER, 2022, 卷号: 34, 期号: 43, 页码: 10
Authors:  Cheng, Chao;  Wang, Shaoqing
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Fourier projection method  molecular dynamics  anharmonic vibration  thermal conductivity  
Theoretical design of BAs/WX2 (X = S, Se) heterostructures for high-performance photovoltaic applications from DFT calculations 期刊论文
APPLIED SURFACE SCIENCE, 2022, 卷号: 599, 页码: 11
Authors:  Guan, Yue;  Li, Xiaodan;  Hu, Qingmiao;  Zhao, Dandan;  Zhang, Lin
Favorite  |  View/Download：41/0  |  Submit date：2022/09/16
First principle calculations  2D materials  Heterojunction  Electronic structure  Electric field  Photovoltaic applications  
Interfacial Reaction and Thermal Stability of the SiCf/TiAl Composites 期刊论文
ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 9, 页码: 1150-1158
Authors:  Shen Yingying;  Zhang Guoxing;  Jia Qing;  Wang Yumin;  Cui Yuyou;  Yang Rui
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SiCf/TiAl composites  vacuum suction casting  interfacial reaction product  element diffusion  
Y Microstructural evolution and embrittlement of a beta-solidifying gamma-TiAl alloy during exposure at 700 degrees C 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 852, 页码: 9
Authors:  Zhou, Zhichun;  Liu, Renci;  Shen, Yingying;  Liu, Yin;  Wang, Peng;  Cui, Yuyou;  Yang, Rui
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TiAl alloy  Thermal exposure  Microstructural evolution  Tensile properties  Embrittlement  
A viable approach to prepare 3C-SiC coatings by thermal MOCVD using commercial grade precursors 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2022, 卷号: 42, 期号: 11, 页码: 4456-4464
Authors:  Liu, Housheng;  Tariq, Naeem ul Haq;  Jing, Weichen;  Cui, Xinyu;  Tang, Mingqiang;  Xiong, Tianying
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HMDSO  MOCVD  SiC  Thermal reduction  
Thermally stable carbon-coated SiC/polydimethylsiloxane nanocomposites for EMI shielding in the terahertz range 期刊论文
MATERIALS RESEARCH BULLETIN, 2022, 卷号: 153, 页码: 9
Authors:  Huang, Feirong;  Fan, Shuting;  Tian, Yuqi;  Qu, Xinghao;  Li, Xiyang;  Javid, Muhammad;  Zhang, Xuefeng;  Zhang, Zhidong;  Dong, Xinglong;  Cao, Tun;  Park, Sung Jin
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ceramics  nanostructures  composites  electronic materials  thermodynamic properties  
Tailoring microstructures of carbon fiber reinforced carbon aerogel-like matrix composites by carbonization to modulate their mechanical properties and thermal conductivities 期刊论文
CARBON, 2022, 卷号: 196, 页码: 807-818
Authors:  Ma, Jian;  Li, Jian;  Guo, Penglei;  Pang, Shengyang;  Hu, Chenglong;  Zhao, Rida;  Tang, Sufang;  Cheng, Hui-Ming
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Carbon aerogels  Fiber reinforced carbon aerogel-like matrix  composites  Pore structure  Mechanical property  Thermal insulation  
High entropy ultra-high temperature ceramic thermal insulator (Zr1/5Hf1/5Nb1/5Ta1/5Ti1/5)C with controlled microstructure and outstanding properties 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2022, 卷号: 119, 页码: 190-199
Authors:  Shao, Zhuojie;  Wu, Zhen;  Sun, Luchao;  Liang, Xianpeng;  Luo, Zhaoping;  Chen, Haikun;  Li, Junning;  Wang, Jingyang
Favorite  |  View/Download：48/0  |  Submit date：2022/07/01
High entropy UHTCs  High porosity  High strength  Low thermal conductivity  Oxidation resistance  
Multiple synergistic losses in the absorption of electromagnetic waves by three-dimensional cross-linked carbon fiber 期刊论文
CARBON, 2022, 卷号: 195, 页码: 308-318
Authors:  Dai, Bushi;  Li, Jinyang;  Liu, Xiaoguang;  Wang, Na;  Dai, Yuxiang;  Qi, Yang
Favorite  |  View/Download：43/0  |  Submit date：2022/09/16
Electromagnetic wave absorption  Carbon fiber  Crystal defects  Graphite nanocrystals  Eddy current loss  Three-dimensional cross-linked structure