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Dwell and Normal Cyclic Fatigue Behaviours of Ti60 Alloy 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 7, 页码: 706-709
作者:  L. N. Yang;  J. R. Liu;  J. Tan;  Z. Y. Chen;  Q. J. Wang;  R. Yang
收藏  |  浏览/下载:114/0  |  提交时间:2015/01/14
Ti60 Alloy  Dwell Fatigue  Quasi-cleavage Facet  Electron Back-scattered  Diffraction (Ebsd)  Strain Accumulation  Room-temperature Creep  Alpha/beta-titanium-alloy  Crystallographic  Orientation  Sensitive Fatigue  Crack-propagation  Ti-6242 Alloy  Texture  Microstructure  Nucleation  Initiation  
Microstructural Characterization and Hardness Behavior of a Biological Saxidomus purpuratus Shell 期刊论文
Journal of Materials Science & Technology, 2011, 卷号: 27, 期号: 2, 页码: 139-146
作者:  W. Yang;  G. P. Zhang;  H. S. Liu;  X. W. Liu
Adobe PDF(1667Kb)  |  收藏  |  浏览/下载:95/0  |  提交时间:2012/04/13
Saxidomus Purpuratus Shell  Microstructure  Hardness  Crossed Lamellar  Indentation  Strombus-gigas  Mechanical-properties  Conch  Seashells  Fracture  Layers  
First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062
作者:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
Adobe PDF(1171Kb)  |  收藏  |  浏览/下载:86/0  |  提交时间:2012/04/13
First-principles Calculation  Segregation  Bismuth  Interface  Snbi  Solder  Reactive Interface  Cu3sn  Cu  Growth  Principles  Fracture  Crystal  Bismuth  Joints  Copper  
Aluminizing Low Carbon Steel at Lower Temperatures 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 4, 页码: 433-436
作者:  X. Si;  B. N. Lu;  Z. B. Wang
Adobe PDF(1311Kb)  |  收藏  |  浏览/下载:92/0  |  提交时间:2012/04/13
Nanostructured Materials  Surface Mechanical Attrition Treatment  Aluminizing  Diffusion  Nucleation  Mechanical Attrition Treatment  Alloy-steels  Coating Formation  Surface-layer  Diffusion  Iron  
Current Status in Layered Ternary Carbide Ti(3)SiC(2), a Review 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 1, 页码: 1-38
作者:  H. B. Zhang;  Y. W. Bao;  Y. C. Zhou
Adobe PDF(7875Kb)  |  收藏  |  浏览/下载:232/0  |  提交时间:2012/04/13
Layered Ternary Ceramics  Ti(3)Sic(2)  Mechanical Properties  Oxidation  Titanium-silicon Carbide  Thermal-shock Behavior  Temperature Oxidation  Behavior  Si-c System  Transmission Electron-microscopy  Chemical-vapor-deposition  Ti3si0.9al0.1c2 Solid-solution  Liquid  Reaction Synthesis  Fatigue-crack Growth  High-purity Ti3sic2  
Microstructural Characterization of the Shear Bands in Fe-Cr-Ni Single Crystal by EBSD 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 6, 页码: 819-828
作者:  H. J. Yang;  J. H. Zhang;  Y. B. Xu;  M. A. Meyers
Adobe PDF(5531Kb)  |  收藏  |  浏览/下载:91/0  |  提交时间:2012/04/13
High-strain Rate Deformation  Adiabatic Shear Band  Electron Backscatter  Diffraction (Ebsd)  Recrystallization  Fe-cr-ni Single Crystal  Severe Plastic-deformation  High-strain-rate  Adiabatic Shear  Stainless-steel  Dynamic Recrystallization  Induced Martensite  Grain-size  Localization  Temperature  Evolution  
Electric Current-induced Failure of 200-nm-thick Gold Interconnects 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 6, 页码: 895-898
作者:  B. Zhang;  Q. Y. Yu;  J. Tan;  G. P. Zhang
Adobe PDF(851Kb)  |  收藏  |  浏览/下载:142/0  |  提交时间:2012/04/13
Au Interconnect  Electric Current  Thermal Fatigue  Failure  Thin Copper-films  Bamboo Al  Electromigration  Mechanisms  Damage  
Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文
Journal of Materials Science & Technology, Journal of Materials Science & Technology, Journal of Materials Science & Technology, 2007, 2007, 2007, 卷号: 23, 23, 23, 期号: 1, 页码: 85-91, 85-91, 85-91
作者:  W. Wang;  Z. G. Wang;  A. P. Xian;  J. K. Shang
收藏  |  浏览/下载:106/0  |  提交时间:2012/04/13
Cbga  Cbga  Cbga  Thermal Cycling  Thermal Cycling  Thermal Cycling  Fem  Fem  Fem  Assembly  Assembly  Assembly  Cracking  Cracking  Cracking  Solder Joint Reliability  Solder Joint Reliability  Solder Joint Reliability  Level Reliability  Level Reliability  Level Reliability  Flex-substrate  Flex-substrate  Flex-substrate  Interconnect  Interconnect  Interconnect  Snagcu  Snagcu  Snagcu  Bga  Bga  Bga  Segregation  Segregation  Segregation  Packages  Packages  Packages  Behavior  Behavior  Behavior  Bismuth  Bismuth  Bismuth