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Dwell and Normal Cyclic Fatigue Behaviours of Ti60 Alloy 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 7, 页码: 706-709
Authors:  L. N. Yang;  J. R. Liu;  J. Tan;  Z. Y. Chen;  Q. J. Wang;  R. Yang
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Ti60 Alloy  Dwell Fatigue  Quasi-cleavage Facet  Electron Back-scattered  Diffraction (Ebsd)  Strain Accumulation  Room-temperature Creep  Alpha/beta-titanium-alloy  Crystallographic  Orientation  Sensitive Fatigue  Crack-propagation  Ti-6242 Alloy  Texture  Microstructure  Nucleation  Initiation  
Microstructural Characterization and Hardness Behavior of a Biological Saxidomus purpuratus Shell 期刊论文
Journal of Materials Science & Technology, 2011, 卷号: 27, 期号: 2, 页码: 139-146
Authors:  W. Yang;  G. P. Zhang;  H. S. Liu;  X. W. Liu
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Saxidomus Purpuratus Shell  Microstructure  Hardness  Crossed Lamellar  Indentation  Strombus-gigas  Mechanical-properties  Conch  Seashells  Fracture  Layers  
First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062
Authors:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
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First-principles Calculation  Segregation  Bismuth  Interface  Snbi  Solder  Reactive Interface  Cu3sn  Cu  Growth  Principles  Fracture  Crystal  Bismuth  Joints  Copper  
Current Status in Layered Ternary Carbide Ti(3)SiC(2), a Review 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 1, 页码: 1-38
Authors:  H. B. Zhang;  Y. W. Bao;  Y. C. Zhou
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Layered Ternary Ceramics  Ti(3)Sic(2)  Mechanical Properties  Oxidation  Titanium-silicon Carbide  Thermal-shock Behavior  Temperature Oxidation  Behavior  Si-c System  Transmission Electron-microscopy  Chemical-vapor-deposition  Ti3si0.9al0.1c2 Solid-solution  Liquid  Reaction Synthesis  Fatigue-crack Growth  High-purity Ti3sic2  
Aluminizing Low Carbon Steel at Lower Temperatures 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 4, 页码: 433-436
Authors:  X. Si;  B. N. Lu;  Z. B. Wang
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Nanostructured Materials  Surface Mechanical Attrition Treatment  Aluminizing  Diffusion  Nucleation  Mechanical Attrition Treatment  Alloy-steels  Coating Formation  Surface-layer  Diffusion  Iron  
Electric Current-induced Failure of 200-nm-thick Gold Interconnects 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 6, 页码: 895-898
Authors:  B. Zhang;  Q. Y. Yu;  J. Tan;  G. P. Zhang
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Au Interconnect  Electric Current  Thermal Fatigue  Failure  Thin Copper-films  Bamboo Al  Electromigration  Mechanisms  Damage  
Microstructural Characterization of the Shear Bands in Fe-Cr-Ni Single Crystal by EBSD 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 6, 页码: 819-828
Authors:  H. J. Yang;  J. H. Zhang;  Y. B. Xu;  M. A. Meyers
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High-strain Rate Deformation  Adiabatic Shear Band  Electron Backscatter  Diffraction (Ebsd)  Recrystallization  Fe-cr-ni Single Crystal  Severe Plastic-deformation  High-strain-rate  Adiabatic Shear  Stainless-steel  Dynamic Recrystallization  Induced Martensite  Grain-size  Localization  Temperature  Evolution  
Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91
Authors:  W. Wang;  Z. G. Wang;  A. P. Xian;  J. K. Shang
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Cbga  Thermal Cycling  Fem  Assembly  Cracking  Solder Joint Reliability  Level Reliability  Flex-substrate  Interconnect  Snagcu  Bga  Segregation  Packages  Behavior  Bismuth