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Structure and properties of Sn-Cu lead-free solders in electronics packaging
Zhao, Meng1; Zhang, Liang1; Liu, Zhi-Quan2; Xiong, Ming-Yue1; Sun, Lei3
Corresponding AuthorZhang, Liang(zhangliang@jsnu.edu.cn)
2019-12-31
Source PublicationSCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
ISSN1468-6996
Volume20Issue:1Pages:421-444
AbstractWith the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. [GRAPHICS] .
KeywordSn-Cu microstructures IMC mechanical properties
Funding OrganizationNational Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project ; China Postdoctoral Science Foundation
DOI10.1080/14686996.2019.1591168
Indexed BySCI
Language英语
Funding ProjectNational Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; [2015DFA50470]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000467812600001
PublisherTAYLOR & FRANCIS LTD
Citation statistics
Cited Times:23[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/133626
Collection中国科学院金属研究所
Corresponding AuthorZhang, Liang
Affiliation1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou, Jiangsu, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China
3.Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing, Jiangsu, Peoples R China
Recommended Citation
GB/T 7714
Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,et al. Structure and properties of Sn-Cu lead-free solders in electronics packaging[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):421-444.
APA Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,Xiong, Ming-Yue,&Sun, Lei.(2019).Structure and properties of Sn-Cu lead-free solders in electronics packaging.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),421-444.
MLA Zhao, Meng,et al."Structure and properties of Sn-Cu lead-free solders in electronics packaging".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):421-444.
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