| Structure and properties of Sn-Cu lead-free solders in electronics packaging | |
| Zhao, Meng1; Zhang, Liang1; Liu, Zhi-Quan2; Xiong, Ming-Yue1; Sun, Lei3 | |
| Corresponding Author | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2019-12-31 | |
| Source Publication | SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
 |
| ISSN | 1468-6996 |
| Volume | 20Issue:1Pages:421-444 |
| Abstract | With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. [GRAPHICS] . |
| Keyword | Sn-Cu microstructures IMC mechanical properties |
| Funding Organization | National Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project ; China Postdoctoral Science Foundation |
| DOI | 10.1080/14686996.2019.1591168 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; [2015DFA50470] |
| WOS Research Area | Materials Science |
| WOS Subject | Materials Science, Multidisciplinary |
| WOS ID | WOS:000467812600001 |
| Publisher | TAYLOR & FRANCIS LTD |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/133626 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, Liang |
| Affiliation | 1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 3.Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing, Jiangsu, Peoples R China |
| Recommended Citation GB/T 7714 | Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,et al. Structure and properties of Sn-Cu lead-free solders in electronics packaging[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):421-444. |
| APA | Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,Xiong, Ming-Yue,&Sun, Lei.(2019).Structure and properties of Sn-Cu lead-free solders in electronics packaging.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),421-444. |
| MLA | Zhao, Meng,et al."Structure and properties of Sn-Cu lead-free solders in electronics packaging".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):421-444. |
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