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Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.;  Yang, J. R.
收藏  |  浏览/下载：123/0  |  提交时间：2021/02/03
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：244/0  |  提交时间：2021/02/02
SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：168/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：138/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Two-Dimensional Titanium Carbide (Ti3C2Tx) MXenes of Different Flake Sizes Studied by Scanning Electrochemical Microscopy in Different Electrolytes 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 6, 页码: 17
作者:  Gupta, Sanju;  Ringo, Wyatt;  Hu, Minmin;  Wang, Xiaohui
收藏  |  浏览/下载：131/0  |  提交时间：2021/02/02
Two-dimensional material  MXenes  flake (particle) size  surface redox chemistry  scanning electrochemical microscopy  
Two-Dimensional Titanium Carbide (Ti3C2Tx) MXenes of Different Flake Sizes Studied by Scanning Electrochemical Microscopy in Different Electrolytes 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 17
作者:  Gupta, Sanju;  Ringo, Wyatt;  Hu, Minmin;  Wang, Xiaohui
收藏  |  浏览/下载：125/0  |  提交时间：2021/02/02
Two-dimensional material  MXenes  flake (particle) size  surface redox chemistry  scanning electrochemical microscopy  
Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9
作者:  Tian, Feifei;  Pang, Xueyong;  Xu, Bo;  Liu, Zhi-Quan
收藏  |  浏览/下载：104/0  |  提交时间：2021/02/02
In-48Sn solder  polycrystalline Cu  Cu-2(In  Sn)  growth orientation  
The Effect of Core-Shell Structure on Microwave Absorption Properties of Graphite-Coated Magnetic Nanocapsules 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 3, 页码: 1429-1435
作者:  Feng, Yang;  Li, Da;  Bai, Yu;  Hua, An;  Pan, Desheng;  Li, Yong;  Wang, Yu;  He, Jun;  Wang, Zhenhua;  Zhang, Yajing;  Liu, Wei;  Zhang, Zhidong
收藏  |  浏览/下载：110/0  |  提交时间：2021/02/02
Microwave absorption mechanism  impedance matching  interface effect  core/shell structure  
The Effect of Core-Shell Structure on Microwave Absorption Properties of Graphite-Coated Magnetic Nanocapsules 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 3, 页码: 1429-1435
作者:  Feng, Yang;  Li, Da;  Bai, Yu;  Hua, An;  Pan, Desheng;  Li, Yong;  Wang, Yu;  He, Jun;  Wang, Zhenhua;  Zhang, Yajing;  Liu, Wei;  Zhang, Zhidong
收藏  |  浏览/下载：117/0  |  提交时间：2021/02/02
Microwave absorption mechanism  impedance matching  interface effect  core/shell structure  
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
作者:  Gao, Li-Yin;  Liu, Zhi-Quan;  Li, Cai-Fu;  Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
收藏  |  浏览/下载：129/0  |  提交时间：2017/08/17
Fe-ni Under Bump Metallization (Ubm)  Thermal Cycling  Microstructural Evolution  Lifetime  Recrystallization  Electron Backscatter Diffraction (Ebsd)