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钯在铜线键合中的作用机理研究 学位论文
, 沈阳: 中国科学院金属研究所, 2020
作者:  杜亚红
收藏  |  浏览/下载：89/0  |  提交时间：2021/03/15
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
作者:  Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
收藏  |  浏览/下载：84/0  |  提交时间：2021/02/03
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
收藏  |  浏览/下载：114/0  |  提交时间：2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
收藏  |  浏览/下载：115/0  |  提交时间：2021/02/02
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781
作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming
收藏  |  浏览/下载：103/0  |  提交时间：2021/02/02
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781
作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming
收藏  |  浏览/下载：95/0  |  提交时间：2021/02/02