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Microstructure evolution of twinning-induced shear bands and correlation with 'RD-split' texture during hot rolling in a Mg-1.1Zn-0.76Y-0.56Zr alloy

期刊论文

MATERIALS CHARACTERIZATION, 2022, 卷号: 187, 页码: 14
作者:  Shi, B. Q.;  Wang, Y. Z.;  Shang, X. L.;  Zhao, L. Y.;  Li, C. Q.;  Chen, D. C.;  Nie, B. H.;  Chen, R. S.;  Ke, W.
收藏  |  浏览/下载:128/0  |  提交时间:2022/07/14
Magnesium alloys  Shear bands  Twinning  Texture  Rolling  
An approach to enhancement of Mg alloy joint performance by additional pass of friction stir processing 期刊论文
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2019, 卷号: 264, 页码: 336-345
作者:  Shang, Q.;  Ni, D. R.;  Xue, P.;  Xiao, B. L.;  Wang, K. S.;  Ma, Z. Y.
收藏  |  浏览/下载:100/0  |  提交时间:2021/02/02
Mg alloy  Friction stir processing  Joint performance enhancement  Texture  Twinning  
Mapping growing stock volume and biomass carbon storage of larch plantations in Northeast China with L-band ALOS PALSAR backscatter mosaics 期刊论文
INTERNATIONAL JOURNAL OF REMOTE SENSING, 2018, 卷号: 39, 期号: 22, 页码: 7978-7997
作者:  Gao, Tian;  Zhu, J. J.;  Yan, Q. L.;  Deng, S. Q.;  Zheng, X.;  Zhang, J. X.;  Shang, G. D.
收藏  |  浏览/下载:140/0  |  提交时间:2021/02/02
Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive 期刊论文
ECS ELECTROCHEMISTRY LETTERS, 2015, 卷号: 4, 期号: 9, 页码: D28-D30
作者:  Tang, J.;  Zhu, Q. S.;  Zhang, Y.;  Zhang, X.;  Guo, J. D.;  Shang, J. K.;  qszhu@imr.ac.cn
收藏  |  浏览/下载:132/0  |  提交时间:2016/04/21
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
作者:  H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
收藏  |  浏览/下载:147/0  |  提交时间:2013/12/24
Under-bump Metallization (Ubm)  Electroless Fe-42ni(p)  Sn  Solderability  Interfacial Reaction  Fe-p  Solderability  Deposition  Alloys  Sn  Behavior  Systems  Surface  Cu  
Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文
Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216
作者:  H. Y. Liu;  Q. S. Zhu;  Z. G. Wang;  J. D. Guo;  J. K. Shang
收藏  |  浏览/下载:104/0  |  提交时间:2013/12/24
Intermetallic Compound Formation  Sn-3.8ag-0.7cu Solder  Cu  Microstructure  Joints  
Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn-Ag-Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2009, 卷号: 502, 期号: 1-2, 页码: 153-158
作者:  Q. S. Zhu;  Z. G. Wang;  S. D. Wu;  J. K. Shang
Adobe PDF(829Kb)  |  收藏  |  浏览/下载:77/0  |  提交时间:2012/04/13
Sn-ag-cu Alloy  Strain Rate Sensitivity  Time-dependent Deformation  Grain Boundary Diffusion  Strain-rate Sensitivity  Lead-free Solders  Superplastic Deformation  Temperature  Joints  Flow  Microstructure  Property  Stresses  
Resistance and magnetization of La(0.7)Ca(0.3)MnO(3) bulk at different resistance states induced by electric pulses 期刊论文
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2008, 卷号: 41, 期号: 2, 页码: 4
作者:  Wu, Z. H.;  Wang, Q.;  Yu, W. D.;  Shang, D. S.;  Li, X. M.;  Chen, L. D.
收藏  |  浏览/下载:88/0  |  提交时间:2021/02/02
The large crygenic magnetocaloric effect of TbAl(2) nanocapules 期刊论文
Scripta Materialia, 2008, 卷号: 59, 期号: 3, 页码: 340-343
作者:  X. G. Liu;  D. Y. Geng;  J. Du;  S. Ma;  B. Li;  P. J. Shang;  Z. D. Zhang
Adobe PDF(382Kb)  |  收藏  |  浏览/下载:74/0  |  提交时间:2012/04/13
Nanocapsules  Arc-discharge  Magnetocaloric  Magnetic-properties  Nanoparticles  Nanocapsules  
Rapid cycle-dependent softening of equal channel angularly pressed Sn-Ag-Cu alloy 期刊论文
Journal of Materials Research, 2008, 卷号: 23, 期号: 10, 页码: 2630-2638
作者:  Q. S. Zhu;  Z. G. Wang;  Q. L. Zeng;  S. D. Wu;  J. K. Shang
Adobe PDF(1023Kb)  |  收藏  |  浏览/下载:73/0  |  提交时间:2012/04/13
Lead-free Solders  Thermomechanical Fatigue  Behavior  Joints  Microstructure  Anisotropy  Metals