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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：144/0  |  提交时间：2018/06/05
Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth  
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 degrees C 期刊论文
NANOSCALE, 2018, 卷号: 10, 期号: 11, 页码: 5254-5263
作者:  Li, WL;  Li, CF;  Lang, FP;  Jiu, JT;  Ueshima, M;  Wang, H;  Liu, ZQ;  Suganuma, K;  Li, WL (reprint author), Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Yamadaoka 2-1, Suita, Osaka, Japan.;  Jiu, JT (reprint author), Osaka Univ, ISIR, Mihogaoka 8-1, Ibaraki, Osaka 5670047, Japan.;  Jiu, JT (reprint author), Senju Met Ind Co Ltd, Adachi Ku, Senju Flashido Cho 23, Tokyo 1208555, Japan.
收藏  |  浏览/下载：144/0  |  提交时间：2018/06/05
Printed Electronics  Nanoparticles  Patterns  Oxide  Films  Decomposition  Reduction  Inkjet  Substrate  Au  
Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via 期刊论文
MATERIALS, 2018, 卷号: 11, 期号: 2, 页码: -
作者:  Sun, FL;  Liu, ZQ;  Li, CF;  Zhu, QS;  Zhang, H;  Suganuma, K;  Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：111/0  |  提交时间：2018/06/05
Columnar-grained Cu  Twins  Boundaries  Nanoscale  Strength  Behavior  Joints