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| Dissolution equilibrium of Bi vapor and activities of Bi in liquid Ni-Cr-Fe-Nb solutions 期刊论文
VACUUM, 2018, 卷号: 156, 页码: 271-276
作者: Li Xiaoliang; Yang Yaqian; Chen Bo; Xing Weiwei; Li Xu; Liu Kui
  收藏 | 浏览/下载：129/0 | 提交时间：2021/02/02
Ni-Cr-Fe-Nb alloys Partial vapor pressure of Bi Activities Activity coeffcients Standard free energy of reaction Delta G(0) |
| Effects of exposure temperature and time on corrosion behavior of a ferritic-martensitic steel P92 in aerated supercritical water 期刊论文
Corrosion Science, 2015, 卷号: 90, 页码: 511-521
作者: X. Y.; Wu Zhong, X. Q.; Han, E. H.
收藏 | 浏览/下载：121/0 | 提交时间：2015/05/08
Steel Sem High Temperature Corrosion Oxidation Bi Eutectic Alloy Dissolved-oxygen Concentration Oxide-growth Mechanisms 316l Stainless-steel Iron-chromium Alloys Oxidation Behavior Steam Oxidation Fe-9cr-1mo Steel In-situ Elevated-temperatures |
| Solidification Behavior of Immiscible Alloys under the Effect of a Direct Current 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 10, 页码: 1027-1035
作者: H. X. Jiang; J. Z. Zhao; J. He
收藏 | 浏览/下载：120/0 | 提交时间：2015/01/14
Rapid Directional Solidification Direct Current Finely Dispersed Microstructure Shell/core Structure Current-carrying Conductors Microstructure Evolution Monotectic Alloys Miscibility Gap Al-bi Interfacial-tension Electric-current Pb Alloys Nucleation Sn |
| Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者: H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：118/0 | 提交时间：2013/02/05
Sn-bi Solder Void Cu3sn Bi Segregation Interfacial Embrittlement Cu Alloys Solder Interconnect Grain-boundaries Single-crystal Bismuth Embrittlement Segregation Copper Strength |
| In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2037Kb) | 收藏 | 浏览/下载：108/0 | 提交时间：2012/04/13
In Situ Observation Shear Creep-fatigue Fracture Sn-58bi Solder Grain-boundary Sliding Lead-free Solders Sn-bi Microstructure Evolution Tensile Properties Alloys Deformation Technology Metals Ag |
| A novel electrodeposited Cu-Zn-Bi film with increased corrosion resistance in a 0.05 M K(2)SO(4) solution 期刊论文
Applied Surface Science, 2011, 卷号: 258, 期号: 2, 页码: 822-826
作者: Y. Guan; X. Peng
Adobe PDF(879Kb) | 收藏 | 浏览/下载：158/0 | 提交时间：2012/04/13
Bi Brass Electrodeposition Crack Corrosion Copper-zinc Alloys Coating Deterioration Computer-simulations Unleaded Brasses Stacking-faults Electrolytes Temperature Bismuth Eis |
| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P; Liu C Z
收藏 | 浏览/下载：112/0 | 提交时间：2021/02/26
SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| Liquid phase separation and microstructure characterization in a designed Al-based amorphous matrix composite with spherical crystalline particles 期刊论文
Journal of Alloys and Compounds, 2010, 卷号: 489, 期号: 2, 页码: 535-540
作者: J. He; H. Q. Li; B. J. Yang; J. Z. Zhao; H. F. Zhang; Z. Q. Hu
Adobe PDF(1295Kb) | 收藏 | 浏览/下载：76/0 | 提交时间：2012/04/13
Amorphous Materials Metallic Glasses Composite Materials Rapid Solidification Phase Transitions Microstructure Bulk Metallic-glass Transient Directional Solidification Mechanical-properties Immiscible Alloys Amorphous/crystalline Composite Supercooled Liquid Magnetic-field Zrc Particles Bi Nucleation |
| Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method 期刊论文
Journal of Electronic Materials, 2005, 卷号: 34, 期号: 11, 页码: 1414-1419
作者: L. W. Wang; A. P. Xian
收藏 | 浏览/下载：68/0 | 提交时间：2012/04/14
Lead (Pb)-free Solders Density Indirect Archimedean Method Liquid Tin (Sn) Alloys Surface-tension Measurements Free Solders Lead Pb Sn Alloys Bi |
| Modeling and simulation of the microstructure evolution during a cooling of immiscible alloys in the miscibility gap 期刊论文
Journal of Materials Science & Technology, 2002, 卷号: 18, 期号: 3, 页码: 197-205
作者: J. Z. Zhao; L. Ratke; J. Jia; Q. C. Li
收藏 | 浏览/下载：153/0 | 提交时间：2012/04/14
Immiscible Alloy Solidification Microstructure Modeling Hypermonotectic Alloys Phase-separation Bi Alloys Pb Alloys Solidification Growth Nucleation Motion Droplets Liquids |
