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Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
作者:  Chen, Jian-Qiang;  Liu, Kai-Lang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：111/0  |  提交时间：2017/08/17
Electromigration  Single Crystal Tin  Cu6sn5  Intermetallic Compounds  Orientation  Diffusion  
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：108/0  |  提交时间：2017/08/17
Cu6sn5 Whiskers  Ag3sn Fibers  Mechanical Property  Screw Dislocation  
Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298
作者:  Chen, Jian-Qiang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：102/0  |  提交时间：2017/08/17
Cu6sn5  Tin  Orientation  Solid State Reaction  Electromigration  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者:  L. M.;  Zhang Yang, Z. F.
收藏  |  浏览/下载：128/0  |  提交时间：2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles