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High-temperature Compressive Performance of Mg Alloy Foams Coated with Ni-P Layer 期刊论文
JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION, 2020, 卷号: 35, 期号: 4, 页码: 805-811
作者:  Lu, Xiaotong;  Luo, Hongjie;  Zhang, Zhigang;  Du, Hao;  Huang, Wenzhan
收藏  |  浏览/下载:136/0  |  提交时间:2021/02/02
Mg alloy foams  electroless plating  high temperature  compressive behavior  Ni-P coating  
High-temperature Compressive Performance of Mg Alloy Foams Coated with Ni-P Layer 期刊论文
JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION, 2020, 卷号: 35, 期号: 4, 页码: 805-811
作者:  Lu, Xiaotong;  Luo, Hongjie;  Zhang, Zhigang;  Du, Hao;  Huang, Wenzhan
收藏  |  浏览/下载:135/0  |  提交时间:2021/02/02
Mg alloy foams  electroless plating  high temperature  compressive behavior  Ni-P coating  
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
作者:  H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
收藏  |  浏览/下载:142/0  |  提交时间:2013/12/24
Under-bump Metallization (Ubm)  Electroless Fe-42ni(p)  Sn  Solderability  Interfacial Reaction  Fe-p  Solderability  Deposition  Alloys  Sn  Behavior  Systems  Surface  Cu  
Corrosion characteristics of electroless Ni-P coatings deposited on W-Cu composite 期刊论文
Corrosion Engineering Science and Technology, 2010, 卷号: 45, 期号: 3, 页码: 235-239
作者:  H. J. Chen;  L. L. Wang;  W. Q. Huang;  L. Hao
Adobe PDF(474Kb)  |  收藏  |  浏览/下载:87/0  |  提交时间:2012/04/13
Electroless Ni-p Coating  Polarisation  Corrosion  W-cu Composite  Abrasive Wear-resistance  Thermochemical Process  Nanocomposite Powder  Sintering Behavior  Hydrogen-reduction  Autocatalytic Nip  Heat-treatment  Sic Coatings  Alloy  Mixture  
Electroless Ni-P coating on W-Cu composite via three different activation processes 期刊论文
Surface Engineering, 2009, 卷号: 25, 期号: 5, 页码: 372-375
作者:  L. Hao;  J. Wei;  F. X. Gan
收藏  |  浏览/下载:82/0  |  提交时间:2012/04/13
Electroless  Ni-p Coating  W-cu Composite  Xrd  Sem  Sintering Behavior  Thermal-conductivity  Nickel  Alloys  Metallization  Deposition  Powder  Fabrication  Reduction  Particles  
Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(1170Kb)  |  收藏  |  浏览/下载:87/0  |  提交时间:2012/04/13
Intermetallic Compound  Electroless Ni-p  Interfacial Reaction  Zn  Addition  Tin  Lead-free Solders  Interfacial Reactions  Cu Substrate  Metallization  Joints  Reliability  Growth  Microstructure  Packages  Alloys  
Electroless Ni-P coating on W-Cu alloy via potential activation process 期刊论文
Surface Engineering, Surface Engineering, 2009, 2009, 卷号: 25, 25, 期号: 5, 页码: 376-381, 376-381
作者:  L. L. Wang;  H. J. Chen;  W. Q. Huang;  L. Hao
收藏  |  浏览/下载:101/0  |  提交时间:2012/04/13
Electroless Deposition  Electroless Deposition  Ni-p Coating  Ni-p Coating  W-cu Alloy  W-cu Alloy  Adhesion  Adhesion  Microhardness  Microhardness  Corrosion Resistance  Corrosion Resistance  Sintering Behavior  Sintering Behavior  Nickel  Nickel  Composite  Composite  Powders  Powders  
Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(2393Kb)  |  收藏  |  浏览/下载:105/0  |  提交时间:2012/04/13
Ag Single Crystal Substrate  Lead-free Solder  Intermetallic Compounds  (Imcs)  Growth Kinetics  Local Cracks  Lead-free Solders  Electroless Ni(p) Metallization  Intermetallic  Compound  Cu-sn  Joints  Ni  Bi  Nanoindentation  Microstructure  Wt.percent  
A novel dual nickel coating on AZ91D magnesium alloy 期刊论文
Transactions of Nonferrous Metals Society of China, 2008, 卷号: 18, 页码: S339-S343
作者:  Y. W. Song;  D. Y. Shan;  R. S. Chen;  E. H. Han
Adobe PDF(730Kb)  |  收藏  |  浏览/下载:99/0  |  提交时间:2012/04/13
Az91d Magnesium Alloy  Dual Coating  Electroplating Ni  Electroless  Plating Ni-p  Corrosion Resistance  High Corrosion-resistance  Electroless  Microstructure  Parameters  Layer  
A new method for electroless Ni-P plating on AZ31 magnesium alloy 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2007, 卷号: 202, 期号: 1, 页码: 133-139
作者:  Zhao, Hui;  Huang, Zhanghong;  Cui, Jianzhong
收藏  |  浏览/下载:88/0  |  提交时间:2021/02/02
organic coatings  interlayer  Ni-P film  electroless plating  corrosion resistance