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Substitution potential of La/Ce/Er for high-cost Sc in rare-earth Al alloys: A comprehensive first-principles study 期刊论文
PHYSICA B-CONDENSED MATTER, 2024, 卷号: 688, 页码: 9
作者:  Yang, Tao;  Yu, Wei-Yuan;  Xue, Hong-Tao;  Yang, Yan-Hong;  Tang, Fu-Ling;  Zhang, Yong;  Ren, Jun-Qiang;  Lu, Xue-Feng;  Li, Jun-Chen
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Rare-earth Al alloys  Substitution formation energy  gamma-Al/gamma '-Al3Sc phase interfaces  Interfacial segregation  First-principles calculation  
Interfacial Kagome lattice transitions induced by segregation of solute atoms 期刊论文
ACTA MATERIALIA, 2024, 卷号: 267, 页码: 11
作者:  Yang, Peijun;  Xie, Hongbo;  Li, Shanshan;  Zhu, Jinbo;  Ma, Xiande;  Jin, Jianfeng;  Pan, Hucheng;  Ren, Yuping;  Zong, Yaping;  Jia, Weitao;  Qin, Gaowu
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Grain boundary  Interfacial transformation  Kagome lattice  Segregation  Magnesium alloy  
Interfacial segregation and precipitation behavior of Cu-rich precipitates in Cu-bearing 316LN stainless steel after aging at different temperatures 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 805, 页码: 8
作者:  Xi, Tong;  Zhang, Xinrui;  Yin, Xueliang;  Yang, Chunguang;  Yang, Ke
收藏  |  浏览/下载：121/0  |  提交时间：2021/10/15
Copper precipitation  Mechanical property  316LN stainless Steel  Interfacial segregation  Atom probe tomography  
Segregation and microstructural evolution at interfaces of atmospheric plasma sprayed thermal barrier coatings during thermal cycling 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 819, 页码: 13
作者:  Liu, Y. Z.;  Hu, X. B.
收藏  |  浏览/下载：128/0  |  提交时间：2021/02/02
Thermal barrier coatings (TBCs)  Microstructural evolution  Interfacial oxidation  Oxidation kinetics  Element segregation  Scanning transmission electron microscopy (STEM)  
Segregation and microstructural evolution at interfaces of atmospheric plasma sprayed thermal barrier coatings during thermal cycling 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 819, 页码: 13
作者:  Liu, Y. Z.;  Hu, X. B.
收藏  |  浏览/下载：112/0  |  提交时间：2021/02/02
Thermal barrier coatings (TBCs)  Microstructural evolution  Interfacial oxidation  Oxidation kinetics  Element segregation  Scanning transmission electron microscopy (STEM)  
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：118/0  |  提交时间：2013/02/05
Sn-bi Solder  Void  Cu3sn  Bi Segregation  Interfacial Embrittlement  Cu  Alloys  Solder Interconnect  Grain-boundaries  Single-crystal  Bismuth  Embrittlement  Segregation  Copper  Strength  
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining 期刊论文
Journal of Materials Science & Technology, 2011, 卷号: 27, 期号: 11, 页码: 1072-1076
作者:  X. F. Zhang;  H. Y. Liu;  J. D. Guo;  J. K. Shang
Adobe PDF(850Kb)  |  收藏  |  浏览/下载：167/0  |  提交时间：2012/04/13
Electromigration  Interfacial Segregation  Prestrain  Dislocation  Vacancy  Electric-current  Segregation  Bi  
Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature 期刊论文
Journal of Materials Research, Journal of Materials Research, 2011, 2011, 卷号: 26, 26, 期号: 3, 页码: 449-454, 449-454
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(440Kb)  |  收藏  |  浏览/下载：94/0  |  提交时间：2012/04/13
Solder Joints  Solder Joints  Interfacial Embrittlement  Interfacial Embrittlement  Single-crystal  Single-crystal  Interconnect  Interconnect  Segregation  Segregation  Tensile  Tensile  Bismuth  Bismuth  
Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328
作者:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2314Kb)  |  收藏  |  浏览/下载：97/0  |  提交时间：2012/04/13
Sn-bi Solder  Bi Segregation  Interfacial Embrittlement  Substrate  Alloying  Reflow Temperature  Tensile Strength  Lead-free Solders  Joints  Microstructure  Embrittlement  Interconnect  Bismuth  Ag  
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate 期刊论文
Journal of Electronic Materials, 2010, 卷号: 39, 期号: 3, 页码: 333-337
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(371Kb)  |  收藏  |  浏览/下载：138/0  |  提交时间：2012/04/13
Polarity Effect  Current Stressing  Effective Charge  Feni  Interfacial  Reactions  Thin-films  Alloy  Segregation  Diffusion  Kinetics