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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：126/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Variation of crystal orientation during epitaxial growth of dendrites by laser deposition 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 4, 页码: 732-735
作者:  Wang, GW;  Liang, JJ;  Zhou, YZ;  Zhao, LB;  Jin, T;  Sun, XF;  Zhou, YZ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：116/0  |  提交时间：2018/06/05
Cyclic Deformation-behavior  Phase-field Simulation  Pb-sn Alloys  Single-crystal  Flowing Melt  Columnar Crystals  Copper Bicrystal  Grain-boundary  Solidification  Superalloy  
Solidification Behavior of Immiscible Alloys under the Effect of a Direct Current 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 10, 页码: 1027-1035
作者:  H. X. Jiang;  J. Z. Zhao;  J. He
收藏  |  浏览/下载：117/0  |  提交时间：2015/01/14
Rapid Directional Solidification  Direct Current  Finely Dispersed  Microstructure  Shell/core Structure  Current-carrying Conductors  Microstructure Evolution  Monotectic  Alloys  Miscibility Gap  Al-bi  Interfacial-tension  Electric-current  Pb Alloys  Nucleation  Sn  
Theoretical calculation of the mixing enthalpies of 21 IIIB-IVB, IIIB-VB and IVB-VB binary alloy systems 期刊论文
Physics of Metals and Metallography, 2013, 卷号: 114, 期号: 6, 页码: 457-468
作者:  B. W. Zhang;  S. Z. Liao;  X. L. Shu;  H. W. Xie;  X. J. Yuan
收藏  |  浏览/下载：110/0  |  提交时间：2013/12/24
b Binary Metal Alloys  Formation/mixing Enthalpies  Systematic  Theoretical Calculations  Subregular Model  Thermodynamic Properties  Laves Phases  Rare-earth  Intermetallic  Compounds  Solid-electrolyte  Metal-alloys  Liquid Pb  Model  Sn  Bismuth  
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：107/0  |  提交时间：2013/12/24
Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
Microstructure and growth mechanism of tin whiskers on RESn3 compounds 期刊论文
Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 589-601
作者:  C. F. Li;  Z. Q. Liu
收藏  |  浏览/下载：99/0  |  提交时间：2013/12/24
Intact Tin Whisker  Resn3 Compounds  In Situ  Transmission Electron  Microscopy (Tem)  Transmission Electron-microscopy  Pb-free Solders  Sn-cu  Surface  Technology  Joints  Bends  
Tin Whisker Growth on NdSn(3) Powder 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 9, 页码: 1962-1966
作者:  H. C. Shi;  A. P. Xian
Adobe PDF(543Kb)  |  收藏  |  浏览/下载：122/0  |  提交时间：2012/04/13
Tin Whiskers  Rare Earth  Intermetallic Compounds  Sn  Ndsn(3)  Pb-free Solders  Mechanism  
In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2667Kb)  |  收藏  |  浏览/下载：77/0  |  提交时间：2012/04/13
Snag/cu Solder Joints  Creep Fatigue  In Situ Observation  Strain  Localization  Grain Subdivision  Lead-free Solders  Pb-sn Solder  Tensile Properties  Shear-strength  Deformation-behavior  Sn-3.5ag Solder  Strain-rate  Ag  Microstructure  Alloys  
Effect of Alloy Insert on Channel Segregation During Solidification of Sn-10 wt pct Bi Alloy 期刊论文
Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2011, 卷号: 42, 期号: 1, 页码: 210-223
作者:  D. R. Liu;  B. G. Sang;  X. H. Kang;  D. Z. Li
Adobe PDF(1537Kb)  |  收藏  |  浏览/下载：129/0  |  提交时间：2012/04/13
Nickel-base Superalloy  Pb-sn Alloys  Directional Solidification  Melting Behavior  Macrosegregation  Ingots  Convection  Scheme  Models  Liquid