中文版 | English

在结果中检索

IMR OpenIR

浏览/检索结果: 共3条，第1-3条 帮助

已选(0)清除 条数/页：   排序方式：
Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
作者:  Chen, Jian-Qiang;  Liu, Kai-Lang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：114/0  |  提交时间：2017/08/17
Electromigration  Single Crystal Tin  Cu6sn5  Intermetallic Compounds  Orientation  Diffusion  
Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
收藏  |  浏览/下载：80/0  |  提交时间：2012/04/13
In Situ Tem  Straining  Single Crystal Sn  Slip System  Self-diffusion  Crack Propagation  Free Solder Alloys  Lead-free Solders  Thermal Fatigue  Behavior  Creep  Tin  Pb  Joints  Ag  Deformation  
A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction 期刊论文
Journal of Applied Physics, 2009, 卷号: 106, 期号: 11
作者:  H. F. Zou;  H. J. Yang;  Z. F. Zhang
Adobe PDF(486Kb)  |  收藏  |  浏览/下载：88/0  |  提交时间：2012/04/13
Ageing  Copper  Copper Alloys  Electron Backscattering  Electron  Diffraction  Texture  Tin Alloys  Wetting  Lead-free Solders  Interfacial Reactions  Single-crystal  Molten Sn  Growth  Joints