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Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy 期刊论文
JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 页码: 11
作者:  Li, Ying-ju;  Zheng, Ce;  Feng, Xiao-hui;  Huang, Qiu-yan;  Luo, Tian-jiao;  Yang, Yuan-sheng
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Ni-based single crystal superalloy  Electric current  Solution heat treatment  Electromigration  Element segregation  
Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy 期刊论文
JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 页码: 11
作者:  Li, Ying-ju;  Zheng, Ce;  Feng, Xiao-hui;  Huang, Qiu-yan;  Luo, Tian-jiao;  Yang, Yuan-sheng
收藏  |  浏览/下载：4/0  |  提交时间：2025/04/27
Ni-based single crystal superalloy  Electric current  Solution heat treatment  Electromigration  Element segregation  
Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy 期刊论文
JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 页码: 11
作者:  Li, Ying-ju;  Zheng, Ce;  Feng, Xiao-hui;  Huang, Qiu-yan;  Luo, Tian-jiao;  Yang, Yuan-sheng
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Ni-based single crystal superalloy  Electric current  Solution heat treatment  Electromigration  Element segregation  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：113/0  |  提交时间：2018/06/05
Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
作者:  Chen, Jian-Qiang;  Liu, Kai-Lang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：114/0  |  提交时间：2017/08/17
Electromigration  Single Crystal Tin  Cu6sn5  Intermetallic Compounds  Orientation  Diffusion  
Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298
作者:  Chen, Jian-Qiang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：106/0  |  提交时间：2017/08/17
Cu6sn5  Tin  Orientation  Solid State Reaction  Electromigration  
Extreme anisotropy of electromigration: Nickel in single-crystal tin 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 687, 页码: 999-1003
作者:  Wei, S;  Ma, HC;  Chen, JQ;  Guo, JD;  Guo, JD (reprint author), Univ Sci & Technol China, Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res,Sch Mat Sci & Engn, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：110/0  |  提交时间：2016/12/28
Electromigration  Single Crystal  Solder  Intermetallics  Anisotropy  
Fast and Huge Anisotropic Diffusion of Cu (Ag) and Its Resistance on the Sn Self-diffusivity in Solid beta-Sn 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2016, 卷号: 32, 期号: 2, 页码: 121-128
作者:  Liu, Peitao;  Wang, Shoulong;  Li, Dianzhong;  Li, Yiyi;  Chen, Xing-Qiu;  xingqiu.chen@imr.ac.cn
收藏  |  浏览/下载：101/0  |  提交时间：2016/04/21
Diffusion  Electromigration  Beta-sn  First-principles  
Fast and Huge Anisotropic Diffusion of Cu (Ag) and Its Resistance on the Sn Self-diffusivity in Solid β-Sn 期刊论文
Journal of Materials Science & Technology, 2016, 卷号: 32, 期号: 2, 页码: 121-128
作者:  Liu Peitao;  Wang Shoulong;  Li Dianzhong;  Li Yiyi;  Chen Xingqiu
收藏  |  浏览/下载：105/0  |  提交时间：2021/02/02
Diffusion  Electromigration  β-Sn  First-principles  
Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current 期刊论文
Journal of Applied Physics, 2014, 卷号: 116, 期号: 10
作者:  X. M. Luo;  B. Zhang;  G. P. Zhang
收藏  |  浏览/下载：170/0  |  提交时间：2015/01/14
Molecular-dynamics Simulation  Fine-grained Materials  Thermal Fatigue  Damage  Deformation-behavior  Cu Interconnects  Current Stress  Electromigration  Films  Technology  Diffusion