中文版 | English

在结果中检索

IMR OpenIR

浏览/检索结果: 共3条，第1-3条 帮助

已选(0)清除 条数/页：   排序方式：
Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics 期刊论文
NANOTECHNOLOGY, 2020, 卷号: 31, 期号: 13, 页码: 9
作者:  Wang, Xin;  Huang, Feirong;  Wang, Dongxing;  Li, Da;  Li, Pu;  Muhammad, Javid;  Dong, Xinglong;  Zhang, Zhidong
收藏  |  浏览/下载：171/0  |  提交时间：2021/02/02
DC arc-discharge method  bimetallic nanoparticles  printed electronics  thermal stability  resistivity  
Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics 期刊论文
Nanotechnology, 2020, 卷号: 31, 期号: 13
作者:  Wang,Xin;  Huang,Feirong;  Wang,Dongxing;  Li,Da;  Li,Pu;  Muhammad,Javid;  Dong,Xinglong;  Zhang,Zhidong
收藏  |  浏览/下载：203/0  |  提交时间：2021/02/02
DC arc-discharge method  bimetallic nanoparticles  printed electronics  thermal stability  resistivity  
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 degrees C 期刊论文
NANOSCALE, 2018, 卷号: 10, 期号: 11, 页码: 5254-5263
作者:  Li, WL;  Li, CF;  Lang, FP;  Jiu, JT;  Ueshima, M;  Wang, H;  Liu, ZQ;  Suganuma, K;  Li, WL (reprint author), Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Yamadaoka 2-1, Suita, Osaka, Japan.;  Jiu, JT (reprint author), Osaka Univ, ISIR, Mihogaoka 8-1, Ibaraki, Osaka 5670047, Japan.;  Jiu, JT (reprint author), Senju Met Ind Co Ltd, Adachi Ku, Senju Flashido Cho 23, Tokyo 1208555, Japan.
收藏  |  浏览/下载：141/0  |  提交时间：2018/06/05
Printed Electronics  Nanoparticles  Patterns  Oxide  Films  Decomposition  Reduction  Inkjet  Substrate  Au