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Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics 期刊论文
NANOTECHNOLOGY, 2020, 卷号: 31, 期号: 13, 页码: 9
Authors:  Wang, Xin;  Huang, Feirong;  Wang, Dongxing;  Li, Da;  Li, Pu;  Muhammad, Javid;  Dong, Xinglong;  Zhang, Zhidong
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DC arc-discharge method  bimetallic nanoparticles  printed electronics  thermal stability  resistivity  
Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics 期刊论文
Nanotechnology, 2020, 卷号: 31, 期号: 13
Authors:  Wang,Xin;  Huang,Feirong;  Wang,Dongxing;  Li,Da;  Li,Pu;  Muhammad,Javid;  Dong,Xinglong;  Zhang,Zhidong
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DC arc-discharge method  bimetallic nanoparticles  printed electronics  thermal stability  resistivity  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
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alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength  
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 degrees C 期刊论文
NANOSCALE, 2018, 卷号: 10, 期号: 11, 页码: 5254-5263
Authors:  Li, WL;  Li, CF;  Lang, FP;  Jiu, JT;  Ueshima, M;  Wang, H;  Liu, ZQ;  Suganuma, K;  Li, WL (reprint author), Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Yamadaoka 2-1, Suita, Osaka, Japan.;  Jiu, JT (reprint author), Osaka Univ, ISIR, Mihogaoka 8-1, Ibaraki, Osaka 5670047, Japan.;  Jiu, JT (reprint author), Senju Met Ind Co Ltd, Adachi Ku, Senju Flashido Cho 23, Tokyo 1208555, Japan.
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Printed Electronics  Nanoparticles  Patterns  Oxide  Films  Decomposition  Reduction  Inkjet  Substrate  Au  
High-Performance Sub-Micrometer Channel WSe2 Field-Effect Transistors Prepared Using a Flood Dike Printing Method 期刊论文
ACS NANO, 2017, 卷号: 11, 期号: 12, 页码: 12536-12546
Authors:  Wu, Fanqi;  Chen, Liang;  Zhang, Anyi;  Hong, Yi-Lun;  Shih, Nai-Yun;  Cho, Seong-Yong;  Drake, Gryphon A.;  Fleetham, Tyler;  Cong, Sen;  Cao, Xuan;  Liu, Qingzhou;  Liu, Yihang;  Xu, Chi;  Ma, Yuqiang;  Shim, Moonsub;  Thompson, Mark E.;  Ren, Wencai;  Cheng, Hui-Ming;  Zhou, Chongwu
Favorite  |  View/Download:63/0  |  Submit date:2021/02/02
tungsten diselenides  transition metal dichalcogenides  TMDC  two-dimensional  chemical vapor deposition  printing  sub-micrometer channel  
High-Performance Sub-Micrometer Channel WSe2 Field-Effect Transistors Prepared Using a Flood Dike Printing Method 期刊论文
ACS NANO, 2017, 卷号: 11, 期号: 12, 页码: 12536-12546
Authors:  Wu, Fanqi;  Chen, Liang;  Zhang, Anyi;  Hong, Yi-Lun;  Shih, Nai-Yun;  Cho, Seong-Yong;  Drake, Gryphon A.;  Fleetham, Tyler;  Cong, Sen;  Cao, Xuan;  Liu, Qingzhou;  Liu, Yihang;  Xu, Chi;  Ma, Yuqiang;  Shim, Moonsub;  Thompson, Mark E.;  Ren, Wencai;  Cheng, Hui-Ming;  Zhou, Chongwu
Favorite  |  View/Download:67/0  |  Submit date:2021/02/02
tungsten diselenides  transition metal dichalcogenides  TMDC  two-dimensional  chemical vapor deposition  printing  sub-micrometer channel  
Reduced graphene oxide with a highly restored pi-conjugated structure for inkjet printing and its use in all-carbon transistors 期刊论文
Nano Research, 2013, 卷号: 6, 期号: 11, 页码: 842-852
Authors:  Y. Su;  J. H. Du;  D. M. Sun;  C. Liu;  H. M. Cheng
Favorite  |  View/Download:78/0  |  Submit date:2013/12/24
Inkjet Printing  Graphene Oxide  High Conductivity  Field Effect  Transistor  Graphite Oxide  High-resolution  Raman-spectra  Films  Reduction  Electrodes  Sheets  Stability  Circuits  Band  
Magnon Band Gap of a Superlattice With Antiferromagnetic Interlayer Exchange Coupling 期刊论文
Ieee Transactions on Magnetics, 2011, 卷号: 47, 期号: 10, 页码: 3122-3125
Authors:  R. K. Qiu;  A. D. Huang;  Z. D. Zhang;  Z. Y. Wang
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Anisotropy  Interlayer Exchange Couplings  Magnetic Superlattice  Magnon  Energy Gap  Ferromagnetic Multilayers  
Magnetic and microwave-absorption properties of SnO-coated alpha-Fe(Sn) nanocapsules 期刊论文
Journal of Physics D-Applied Physics, 2010, 卷号: 43, 期号: 49
Authors:  Z. H. Wang;  X. He;  X. Wang;  Z. Han;  D. Y. Geng;  Y. L. Zhu;  Z. D. Zhang
Adobe PDF(858Kb)  |  Favorite  |  View/Download:50/0  |  Submit date:2012/04/13
Electromagnetic-wave Absorption  Nanocomposites  Iron  Spectroscopy  Nanorods  Range  Esca  Aes  
Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate 期刊论文
Journal of Materials Research, 2010, 卷号: 25, 期号: 2, 页码: 303-314
Authors:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2455Kb)  |  Favorite  |  View/Download:71/0  |  Submit date:2012/04/13
Interfacial Embrittlement  Mechanical-properties  Grain-boundaries  Sn-3.5ag Solders  Bismuth Solder  Copper  Segregation  Metallization  Interconnect  Strength