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Anisotropic mechanical properties and deformation mechanisms of nanotwinned Ni and Ni alloys with extremely fine twin boundary spacings 期刊论文
ACTA MATERIALIA, 2023, 卷号: 260, 页码: 12
Authors:  Duan, Fenghui;  Li, Qian;  Shen, Zheling;  Jiang, Zhihao;  Liu, Wenbin;  Yan, Yang;  Pan, Jie;  Sun, Ligang;  Lu, Jian
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Nanotwins  Anisotropic mechanical behavior  Continuous strengthening  Extremely fine twin boundary spacing  Localized plasticity  
Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles 期刊论文
Acta Materialia, 2009, 卷号: 57, 期号: 20, 页码: 6215-6225
Authors:  E. W. Qin;  L. Lu;  N. R. Tao;  J. Tan;  K. Lu
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Fracture Toughness  Nanostructures  Nanoscale Twins  Dynamic Plastic  Deformation  Recrystallization  Dynamic Plastic-deformation  Microstructural Evolution  Mechanical-properties  Nanostructured Metal  Tensile Deformation  Grain-growth  Copper  Behavior  Ductility  Nickel  
Influence of stacking-fault energy on the accommodation of severe shear strain in Cu-Al alloys during equal-channel angular pressing 期刊论文
Journal of Materials Research, 2009, 卷号: 24, 期号: 12, 页码: 3636-3646
Authors:  X. H. An;  Q. Y. Lin;  S. Qu;  G. Yang;  S. D. Wu;  Z. F. Zhang
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Severe Plastic-deformation  High-pressure Torsion  Grain-refinement  Mechanical-properties  Microstructural Evolution  Nanostructured  Materials  Stainless-steel  Single-crystal  Copper  Temperatures  
An Investigation on Hall-Petch Relationship in Electrodeposited Nanocrystalline Cu-Ni-P Alloys 期刊论文
Journal of Materials Science & Technology, Journal of Materials Science & Technology, 2009, 2009, 卷号: 25, 25, 期号: 3, 页码: 347-350, 347-350
Authors:  H. Q. Sun;  Y. N. Shi
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Nanomaterials  Nanomaterials  Mechanical Properties  Mechanical Properties  Hardness  Hardness  Strain-rate Sensitivity  Strain-rate Sensitivity  Tomographic Atom-probe  Tomographic Atom-probe  Plastic-deformation  Plastic-deformation  Mechanical-behavior  Mechanical-behavior  Thermal-stability  Thermal-stability  Metals  Metals  Copper  Copper  Strength  Strength  Fracture  Fracture  Microstructure  Microstructure  
Revealing the Maximum Strength in Nanotwinned Copper 期刊论文
Science, Science, 2009, 2009, 卷号: 323, 323, 期号: 5914, 页码: 607-610, 607-610
Authors:  L. Lu;  X. Chen;  X. Huang;  K. Lu
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Strain-rate Sensitivity  Strain-rate Sensitivity  Coherent Twin Boundaries  Coherent Twin Boundaries  Centered-cubic  Centered-cubic  Metals  Metals  Nanocrystalline Copper  Nanocrystalline Copper  Nanostructured Metals  Nanostructured Metals  Mechanical-properties  Mechanical-properties  Tensile Properties  Tensile Properties  Dislocations  Dislocations  Deformation  Deformation  Cu  Cu  
Current Status in Layered Ternary Carbide Ti(3)SiC(2), a Review 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 1, 页码: 1-38
Authors:  H. B. Zhang;  Y. W. Bao;  Y. C. Zhou
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Layered Ternary Ceramics  Ti(3)Sic(2)  Mechanical Properties  Oxidation  Titanium-silicon Carbide  Thermal-shock Behavior  Temperature Oxidation  Behavior  Si-c System  Transmission Electron-microscopy  Chemical-vapor-deposition  Ti3si0.9al0.1c2 Solid-solution  Liquid  Reaction Synthesis  Fatigue-crack Growth  High-purity Ti3sic2  
Effect of the Zener-Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation 期刊论文
Acta Materialia, 2009, 卷号: 57, 期号: 3, 页码: 761-772
Authors:  Y. S. Li;  Y. Zhang;  N. R. Tao;  K. Lu
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Copper  Plastic Deformation  Nanostructures  Zener Hollomon Parameter  Nanoscale Deformation Twinning  Stacking-fault Energy  Grain-refinement  Large Strains  Nanocrystalline  Materials  Rolling Deformation  Copper  Evolution  Metals  Nickel  Attrition  
Current progress of mechanical properties of metals with nano-scale twins 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 4, 页码: 473-482
Authors:  L. Lu
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Nanostructured Metallic Materials  Twin Boundary  Strengthening  Ductility  Rate Sensitivity  Deformation Mechanism  Strain-rate Sensitivity  Ultrafine-grained Metals  Centered-cubic  Metals  Nanocrystalline Copper  Nanostructured Metals  Tensile  Properties  Nanoscale Twins  Deformation-behavior  Ultrahigh-strength  Activation Volume  
Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures 期刊论文
Acta Materialia, 2008, 卷号: 56, 期号: 2, 页码: 230-241
Authors:  Y. S. Li;  N. R. Tao;  K. Lu
Adobe PDF(3751Kb)  |  Favorite  |  View/Download:95/0  |  Submit date:2012/04/13
Nanostructured Materials  Copper  Dynamic Plastic Deformation  Deformation Twinning  Shear Banding  Mechanical Attrition Treatment  Grain-refinement  Shear Bands  Single-crystals  Large Strains  Metals  Cu  Recrystallization  Strength  Nickel  
Ductile TiAl alloy with a Widmanstatten lamellar structure formed by rapid heating 期刊论文
Journal of Materials Research, 2008, 卷号: 23, 期号: 4, 页码: 949-953
Authors:  J. P. Cui;  M. L. Sui;  Y. Y. Cui;  D. X. Li
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Al-alloys  Massive Transformation  Mechanical-properties  Deformation-behavior  Titanium Aluminides  Phase-equilibria  Creep-behavior  Gamma  Alpha  Microstructures