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Hydrogen-based direct reduction of iron oxide at 700 degrees C: Heterogeneity at pellet and microstructure scales 期刊论文
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2022, 卷号: 29, 期号: 10, 页码: 1901-1907
Authors:  Ma, Yan;  Souza Filho, Isnaldi R.;  Zhang, Xue;  Nandy, Supriya;  Barriobero-Vila, Pere;  Requena, Guillermo;  Vogel, Dirk;  Rohwerder, Michael;  Ponge, Dirk;  Springer, Hauke;  Raabe, Dierk
Favorite  |  View/Download：51/0  |  Submit date：2022/09/16
hydrogen-based direct reduction  iron oxide  microstructure  spatial gradient  metallization  
Influence of Al2O3 content on microstructure, electrical conductivity and adhesion strength of cold sprayed Al-Al2O3 coatings on PEEK substrate 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 446, 页码: 13
Authors:  Liu, Hanhui;  Tariq, Naeem ul Haq;  Ren, Yupeng;  Zhao, Lijia;  Yang, Ying;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
Favorite  |  View/Download：68/0  |  Submit date：2022/09/16
Cold spray  PEEK  Al-Al2O3 coating  Surface metallization  Electrical conductivity  Adhesion strength  
Effect of accelerating gas temperature on microstructure and properties of cold sprayed Al coating on polyether ether ketone (PEEK) 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 429, 页码: 11
Authors:  Liu, Hanhui;  Tariq, Naeem ul Haq;  Ren, Yupeng;  Luo, Jing;  Liu, Housheng;  Zhao, LiJia;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
Favorite  |  View/Download：65/0  |  Submit date：2022/01/27
Cold spray  PEEK  Accelerating gas temperature  Coating properties  Surface metallization  Deposition behavior  
Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
Authors:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
Favorite  |  View/Download：70/0  |  Submit date：2021/02/02
Solderability  Electroless FeP  SnAgCu  Oxidation  
Investigation on enhancing the thermal conductance of gallium-based thermal interface materials using chromium-coated diamond particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 7, 页码: 7194-7202
Authors:  Wei, S.;  Yu, Z. F.;  Zhou, L. J.;  Guo, J. D.
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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Favorite  |  View/Download：95/0  |  Submit date：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
Authors:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
Favorite  |  View/Download：71/0  |  Submit date：2018/06/05
Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
Authors:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
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ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure  
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
Authors:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
Favorite  |  View/Download：58/0  |  Submit date：2021/02/02
ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure  
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Authors:  Gao, Li-Yin;  Liu, Zhi-Quan;  Li, Cai-Fu;  Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
Favorite  |  View/Download：86/0  |  Submit date：2017/08/17
Fe-ni Under Bump Metallization (Ubm)  Thermal Cycling  Microstructural Evolution  Lifetime  Recrystallization  Electron Backscatter Diffraction (Ebsd)