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Progress in ceramic materials and structure design toward advanced thermal barrier coatings 期刊论文
Journal of Advanced Ceramics, 2022, 卷号: 11, 期号: 7
Authors:  Wei,Zhi-Yuan;  Meng,Guo-Hui;  Chen,Lin;  Li,Guang-Rong;  Liu,Mei-Jun;  Zhang,Wei-Xu;  Zhao,Li-Na;  Zhang,Qiang;  Zhang,Xiao-Dong;  Wan,Chun-Lei;  Qu,Zhi-Xue;  Chen,Lin;  Feng,Jing;  Liu,Ling;  Dong,Hui;  Bao,Ze-Bin;  Zhao,Xiao-Feng;  Zhang,Xiao-Feng;  Guo,Lei;  Wang,Liang;  Cheng,Bo;  Zhang,Wei-Wei;  Xu,Peng-Yun;  Yang,Guan-Jun;  Cai,Hong-Neng;  Cui,Hong;  Wang,You;  Ye,Fu-Xing;  Ma,Zhuang;  Pan,Wei;  Liu,Min;  Zhou,Ke-Song;  Li,Chang-Jiu
Favorite  |  View/Download：128/0  |  Submit date：2022/07/14
thermal barrier coatings (TBCs)  ceramic material  degradation and failure  structure design  long lifetime  
Reaction-Induced Strong Metal-Support Interactions between Metals and Inert Boron Nitride Nanosheets 期刊论文
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2020, 卷号: 142, 期号: 40, 页码: 17167-17174
Authors:  Dong, Jinhu;  Fu, Qiang;  Li, Haobo;  Xiao, Jianping;  Yang, Bing;  Zhang, Bingsen;  Bai, Yunxing;  Song, Tongyuan;  Zhang, Rankun;  Gao, Lijun;  Cai, Jun;  Zhang, Hui;  Liu, Zhi;  Bao, Xinhe
Favorite  |  View/Download：182/0  |  Submit date：2021/02/02
The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
Authors:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
Favorite  |  View/Download：160/0  |  Submit date：2021/02/02
AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack  
一种松香树脂转移石墨烯的方法及石墨烯透明导电薄膜的制备与应用 专利
专利类型: 发明专利, 专利号: 201611065371.3, 申请日期: 2019-08-16,
Inventors:  杜金红、张志坤、张鼎冬、马来鹏、任文才、成会明
Favorite  |  View/Download：116/0  |  Submit date：2021/03/01
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
Favorite  |  View/Download：133/0  |  Submit date：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
Favorite  |  View/Download：126/0  |  Submit date：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
氧化石墨烯／石墨烯叠层透明导电薄膜及其制备和应用 专利
专利类型: 发明专利, 专利号: 201610080444.X, 申请日期: 2019-05-10,
Inventors:  杜金红、贾帅、张志坤、张鼎冬、任文才、成会明
Favorite  |  View/Download：174/0  |  Submit date：2021/03/01
Plasmon-Resonant Enhancement of Photocatalysis on Monolayer WSe2 期刊论文
ACS PHOTONICS, 2019, 卷号: 6, 期号: 3, 页码: 787-792
Authors:  Chen, Jihan;  Bailey, Connor S.;  Hong, Yilun;  Wang, Li;  Cai, Zhi;  Shen, Lang;  Hou, Bingya;  Wang, Yu;  Shi, Haotian;  Sambur, Justin;  Ren, Wencai;  Pop, Eric;  Cronin, Stephen B.
Favorite  |  View/Download：99/0  |  Submit date：2021/02/02
plasmon  photocatalysis  tungsten diselenide  water splitting  enhancement  FDTD  TMDC  
Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 3, 页码: 3231-3240
Authors:  Li, Cai-Fu;  Li, Wanli;  Zhang, Hao;  Liu, Jinting;  Yang, Yang;  Li, Lingying;  Gao, Yue;  Liu, Zhi-Quan;  Suganuma, Katsuaki
Favorite  |  View/Download：154/0  |  Submit date：2021/02/02
conductive pastes  stretchable wirings  stretchable bonding  Ag microflakes  recoverability  
Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 42, 页码: 36128-36135
Authors:  Zhou, Kai Ling;  Han, Chang Bao;  Li, Cai Fu;  Jiu, Jinting;  Yang, Yang;  Li, Ling;  Wang, Hao;  Liu, Jing Bing;  Liu, Zhi Quan;  Yan, Hui;  Suganuma, Katsuaki
Favorite  |  View/Download：117/0  |  Submit date：2021/02/02
Ag Nanowires  Ag@Pt alloy  transparent conductive electrodes  corrosion resistance  flexible optoelectronic devices