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A superior interfacial reliability of Fe-Ni UBM during high temperature storage
Gao, Li-Yin; Li, Cai-Fu; Wan, Peng; Liu, Zhi-Quan; Li, CF; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
2017-06-01
发表期刊JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
卷号28期号:12页码:8537-8545
摘要Ball shear test was conducted on the SnAgCu/Fe-Ni solder joints, as well as SnAgCu/Cu for comparison after reflow and 150 degrees C high temperature storage following the industrial JEDEC standards. According to microstructural observation, Fe-Ni UBMs show better diffusion barrier effect than Cu UBM, which form very thin FeSn2 or FeSn2+(Cu, Ni)(6)Sn-5 layers at the interface without any Kirkendall voids. With such thin IMC layers, the shear strengths of Fe-Ni solder joints were comparable to Cu solder joints, which are in the range of 6.3-6.4 mg/mu m(2) after reflow and then fall into 4.7-5.1 mg/mu m(2) after 1000 h storage. Statistic observations revealed four kinds of fracture mode among failed solder joints, which are ductile fracture, brittle fracture, UBM fracture and pad lift respectively. The UBM fracture is the most common failure mode for Cu solder joint due to the fast consumption and low mechanical strength of Cu UBM, while the ductile failure takes the majority for Fe-Ni UBMs although it gradually turned into brittle fracture later as the aging time increased. The related mechanism of fracture behavior was also discussed concerning the physical properties of interfacial IMCs. Combining the low IMC growth rate, the comparable shear strength and the ductile fracture mode, Fe-45Ni UBM is superior to Cu UBM on the interfacial reliability of high temperature storage.; Ball shear test was conducted on the SnAgCu/Fe-Ni solder joints, as well as SnAgCu/Cu for comparison after reflow and 150 degrees C high temperature storage following the industrial JEDEC standards. According to microstructural observation, Fe-Ni UBMs show better diffusion barrier effect than Cu UBM, which form very thin FeSn2 or FeSn2+(Cu, Ni)(6)Sn-5 layers at the interface without any Kirkendall voids. With such thin IMC layers, the shear strengths of Fe-Ni solder joints were comparable to Cu solder joints, which are in the range of 6.3-6.4 mg/mu m(2) after reflow and then fall into 4.7-5.1 mg/mu m(2) after 1000 h storage. Statistic observations revealed four kinds of fracture mode among failed solder joints, which are ductile fracture, brittle fracture, UBM fracture and pad lift respectively. The UBM fracture is the most common failure mode for Cu solder joint due to the fast consumption and low mechanical strength of Cu UBM, while the ductile failure takes the majority for Fe-Ni UBMs although it gradually turned into brittle fracture later as the aging time increased. The related mechanism of fracture behavior was also discussed concerning the physical properties of interfacial IMCs. Combining the low IMC growth rate, the comparable shear strength and the ductile fracture mode, Fe-45Ni UBM is superior to Cu UBM on the interfacial reliability of high temperature storage.
部门归属[gao, li-yin ; li, cai-fu ; wan, peng ; liu, zhi-quan] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china ; [gao, li-yin ; wan, peng ; liu, zhi-quan] univ chinese acad sci, beijing 100049, peoples r china
学科领域Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
资助者Natural Science Foundation of China [51401218]; Major National Science and Technology Program of China [2011ZX02602]
收录类别SCI
语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/78112
专题中国科学院金属研究所
通讯作者Li, CF; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China.; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
推荐引用方式
GB/T 7714
Gao, Li-Yin,Li, Cai-Fu,Wan, Peng,et al. A superior interfacial reliability of Fe-Ni UBM during high temperature storage[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):8537-8545.
APA Gao, Li-Yin.,Li, Cai-Fu.,Wan, Peng.,Liu, Zhi-Quan.,Li, CF.,...&Liu, ZQ .(2017).A superior interfacial reliability of Fe-Ni UBM during high temperature storage.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,28(12),8537-8545.
MLA Gao, Li-Yin,et al."A superior interfacial reliability of Fe-Ni UBM during high temperature storage".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 28.12(2017):8537-8545.
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