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| Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 卷号: 29, 期号: 3, 页码: 151-155
作者: Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
  收藏 | 浏览/下载：145/0 | 提交时间：2021/02/02
Alloys Sn-Ag-Cu Finite element modeling (FEM) Reliability |
| Stability of interfaces in a multilayered Ag-Cu composite during cold rolling 期刊论文
Scripta Materialia, 2013, 卷号: 68, 期号: 7, 页码: 542-545
作者: Y. Z. Tian; Z. F. Zhang
收藏 | 浏览/下载：78/0 | 提交时间：2013/12/24
Ag-cu Composite Twin Boundary Multilayer Cold Rolling Filamentary Composites Mechanical-properties Twin Boundaries High-strength Deformation Alloys Evolution Copper Microstructures Orientation |
| Determining the minimum grain size in severe plastic deformation process via first-principles calculations 期刊论文
Acta Materialia, 2012, 卷号: 60, 期号: 11, 页码: 4506-4513
作者: S. Lu; Q. M. Hu; E. K. Delczeg-Czirjak; B. Johansson; L. Vitos
收藏 | 浏览/下载：149/0 | 提交时间：2013/02/05
Minimum Grain Size Stacking Fault Energy First-principles Theory Severe Plastic Deformation Stacking-fault Energy Austenitic Stainless-steels Cu-al Alloys Electronic Topological Transitions Channel-angular-extrusion Metallic Random Alloys High-pressure Torsion Copper-nickel-alloys Pd-ag Alloys Mechanical-properties |
| Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Corrosion Science, 2012, 卷号: 63, 页码: 20-28
作者: M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏 | 浏览/下载：75/0 | 提交时间：2013/02/05
Electronic Materials Alloy Sem Xps Atmospheric Corrosion Lead-free Solders Ag-cu Alloys Electrochemical Corrosion Nacl Solution Tin Behavior Microstructure Surface |
| Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2012, 卷号: 23, 期号: 1, 页码: 148-155
作者: M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏 | 浏览/下载：82/0 | 提交时间：2013/02/05
Ag-cu Alloys Electrochemical Corrosion Buffer Solutions Nacl Solution Tin Snagcu Joints |
| Design of ductile bulk metallic glasses by adding "soft" atoms 期刊论文
Applied Physics Letters, 2012, 卷号: 100, 期号: 14
作者: N. Zheng; R. T. Qu; S. Pauly; M. Calin; T. Gemming; Z. F. Zhang; J. Eckert
收藏 | 浏览/下载：93/0 | 提交时间：2013/02/05
Mechanical-properties Forming Ability Amorphous-alloys Cu Behavior Plasticity Ag Deformation Improvement Toughness |
| Bulk eutectic Cu-Ag alloys with abundant twin boundaries 期刊论文
Scripta Materialia, 2012, 卷号: 66, 期号: 2, 页码: 65-68
作者: Y. Z. Tian; Z. F. Zhang
收藏 | 浏览/下载：97/0 | 提交时间：2013/02/05
Eutectic Cu-ag Alloy Twin Boundary Electron Backscattering Diffraction (Ebsd) Strength Ductility Strain-rate Sensitivity Mechanical-properties Nanostructured Materials Plastic-deformation Tensile Properties Maximum Strength Nanoscale Twins Al Alloys Ductility Metals |
| 严重塑性变形技术制备双相铜银合金的组织和力学性能研究 学位论文
, 北京: 中国科学院金属研究所, 2012
作者: 田艳中
收藏 | 浏览/下载：110/0 | 提交时间：2013/04/12
铜银合金 高压扭转 等通道转角挤压 强度 硬度 Cu-ag Alloys High-pressure Torsion (Hpt) Equal-channel Angular Pressing (Ecap) Strength Hardness |
| In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2667Kb) | 收藏 | 浏览/下载：79/0 | 提交时间：2012/04/13
Snag/cu Solder Joints Creep Fatigue In Situ Observation Strain Localization Grain Subdivision Lead-free Solders Pb-sn Solder Tensile Properties Shear-strength Deformation-behavior Sn-3.5ag Solder Strain-rate Ag Microstructure Alloys |
| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P; Liu C Z
收藏 | 浏览/下载：112/0 | 提交时间：2021/02/26
SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
