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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：114/0  |  提交时间：2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：112/0  |  提交时间：2017/08/17
Cu6sn5 Whiskers  Ag3sn Fibers  Mechanical Property  Screw Dislocation  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者:  L. M.;  Zhang Yang, Z. F.
收藏  |  浏览/下载：136/0  |  提交时间：2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles  
Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350
作者:  H. Y. Song;  Q. S. Zhu;  Z. G. Wang;  J. K. Shang;  M. Lu
Adobe PDF(3308Kb)  |  收藏  |  浏览/下载：128/0  |  提交时间：2012/04/13
Lead-free Solder  Sn-ag-cu Alloy  Zn Addition  Tensile Property  Intermetallic Compound  Sn-ag-cu  Free Solder Alloy  Interfacial Reactions  Deformation  Reliability  Joints  Ag3sn  Creep