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| Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者: M. N. Wang; J. Q. Wang; W. Ke
  收藏 | 浏览/下载：116/0 | 提交时间：2014/04/18
Lead-free Solders 3.5-percent Nacl Solution Electrochemical Corrosion Ga Solder Reliability Surface Alloys Joints Tin Sn |
| In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655
作者: M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏 | 浏览/下载：112/0 | 提交时间：2013/02/05
Lead-free Solder Microstructure Corrosion Three-point Bending Fracture Electrochemical Corrosion Behavior 3.5-percent Nacl Solution Ga Solder Alloys Sn Joints |
| In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2037Kb) | 收藏 | 浏览/下载：108/0 | 提交时间：2012/04/13
In Situ Observation Shear Creep-fatigue Fracture Sn-58bi Solder Grain-boundary Sliding Lead-free Solders Sn-bi Microstructure Evolution Tensile Properties Alloys Deformation Technology Metals Ag |
| In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2667Kb) | 收藏 | 浏览/下载：79/0 | 提交时间：2012/04/13
Snag/cu Solder Joints Creep Fatigue In Situ Observation Strain Localization Grain Subdivision Lead-free Solders Pb-sn Solder Tensile Properties Shear-strength Deformation-behavior Sn-3.5ag Solder Strain-rate Ag Microstructure Alloys |
| Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者: P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏 | 浏览/下载：80/0 | 提交时间：2012/04/13
In Situ Tem Straining Single Crystal Sn Slip System Self-diffusion Crack Propagation Free Solder Alloys Lead-free Solders Thermal Fatigue Behavior Creep Tin Pb Joints Ag Deformation |
| Tin whisker growth on bulk Sn-Pb eutectic doping with Nd 期刊论文
Microelectronics Reliability, 2009, 卷号: 49, 期号: 6, 页码: 667-672
作者: M. Liu; A. P. Xian
Adobe PDF(530Kb) | 收藏 | 浏览/下载：100/0 | 提交时间：2012/04/13
Free Solder Alloys Surface Cu Joints |
| Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder 期刊论文
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 6, 页码: 811-816
作者: J. J. Guo; L. Zhang; A. P. Xian; J. K. Shang
收藏 | 浏览/下载：87/0 | 提交时间：2012/04/13
Solderability Feni Alloys Lead-free Solders Wetting Electroless-nickel/solder Interface Enig Plating Layer Thermal-stability Sn-0.4cu Solder Cu Substrate Plated Kovar Sn Reflow Copper Part |
