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| Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者: Cao Lihua; Chen Yinbo; Shi Qiyuan; Yuan Jie; Liu Zhiquan
  收藏 | 浏览/下载：237/0 | 提交时间：2021/02/02
alloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength |
| Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者: L. M.; Zhang Yang, Z. F.
收藏 | 浏览/下载：136/0 | 提交时间：2015/05/08
Intermetallic Compounds (Imc) Solder Joint Cooling Rate Solidification Adsorption Ag-cu Solder Cu6sn5 Grains In-situ Sn Alloy Nanoparticles Ag3sn Microstructure Technology Particles |
| Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者: L. M. Yang; Z. F. Zhang
收藏 | 浏览/下载：111/0 | 提交时间：2013/12/24
Lead-free Solder Intermetallic Compounds Interfacial Reaction Grain Growth Sn-ag-cu Shear-strength Mechanical-properties Rare-earth Bga Joints Alloy Electromigration Reliability |
| Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文
Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238
作者: C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang
Adobe PDF(398Kb) | 收藏 | 浏览/下载：98/0 | 提交时间：2012/04/13
Thin-films Sn-ag Alloy Cu Systems Fe-42ni Copper Ni Intermetallics Solderability |
| Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM 期刊论文
Advanced Engineering Materials, 2010, 卷号: 12, 期号: 6, 页码: 497-503
作者: Q. S. Zhu; J. J. Guo; P. J. Shang; Z. G. Wang; J. K. Shang
Adobe PDF(1514Kb) | 收藏 | 浏览/下载：103/0 | 提交时间：2012/04/13
p Alloy Film Sn-ag Solder Phosphorus Concentration Joints Strength Chip Metallization Interconnect Segregation Technology |
| Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
作者: Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang
Adobe PDF(2369Kb) | 收藏 | 浏览/下载：117/0 | 提交时间：2012/04/13
Lead-free Solder Fatigue Fracture Interface Strain Localization Vertical Cracks Lead-free Solders Pb-free Solders Deformation-behavior Joints Tensile Cu Embrittlement Temperature Sn-3.5ag Alloy |
| Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350
作者: H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu
Adobe PDF(3308Kb) | 收藏 | 浏览/下载：130/0 | 提交时间：2012/04/13
Lead-free Solder Sn-ag-cu Alloy Zn Addition Tensile Property Intermetallic Compound Sn-ag-cu Free Solder Alloy Interfacial Reactions Deformation Reliability Joints Ag3sn Creep |
| Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2506-2515
作者: J. P. Daghfal; P. J. Shang; Z. Q. Liu; J. K. Shang
Adobe PDF(631Kb) | 收藏 | 浏览/下载：129/0 | 提交时间：2012/04/13
In-sn Solder Ni-fe Metallization Interface Fesn(2) Ni(3)Sn(4) Faceting In-48sn Solder In-49sn Solder Reflow Process Microstructure Substrate Packages Kinetics Alloy Joint Ag |
| Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn-Ag-Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2009, 卷号: 502, 期号: 1-2, 页码: 153-158
作者: Q. S. Zhu; Z. G. Wang; S. D. Wu; J. K. Shang
Adobe PDF(829Kb) | 收藏 | 浏览/下载：74/0 | 提交时间：2012/04/13
Sn-ag-cu Alloy Strain Rate Sensitivity Time-dependent Deformation Grain Boundary Diffusion Strain-rate Sensitivity Lead-free Solders Superplastic Deformation Temperature Joints Flow Microstructure Property Stresses |
| Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文
Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129
作者: H. F. Zou; Z. F. Zhang
Adobe PDF(797Kb) | 收藏 | 浏览/下载：129/0 | 提交时间：2012/04/13
Sn-ag-zn Lead-free Solder Gravity Interfaces Intermetallic Compounds Lead-free Solders Cu Substrate Bump Metallization Tensile Properties Phase-equilibria Eutectic Alloy Ni Behavior Bi Microstructure |
