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In-Phase Thermal-Mechanical Fatigue Behavior and Damage Mechanism of a Fourth-Generation Ni-Based Single-Crystal Superalloy 期刊论文
ACTA METALLURGICA SINICA, 2024, 卷号: 60, 期号: 2, 页码: 154-166
作者:  Tan Zihao;  Li Yongmei;  Wang Xinguang;  Zhao Haochuan;  Tan Haibing;  Wang Biao;  Li Jinguo;  Zhou Yizhou;  Sun Xiaofeng
收藏  |  浏览/下载:2/0  |  提交时间:2025/04/27
fourth-generation single-crystal superalloy  thermal-mechanical fatigue  fracture characteristic  oxidation behavior  damage mechanism  
In-Phase Thermal-Mechanical Fatigue Behavior and Damage Mechanism of a Fourth-Generation Ni-Based Single-Crystal Superalloy 期刊论文
ACTA METALLURGICA SINICA, 2024, 卷号: 60, 期号: 2, 页码: 154-166
作者:  Tan Zihao;  Li Yongmei;  Wang Xinguang;  Zhao Haochuan;  Tan Haibing;  Wang Biao;  Li Jinguo;  Zhou Yizhou;  Sun Xiaofeng
收藏  |  浏览/下载:2/0  |  提交时间:2025/04/27
fourth-generation single-crystal superalloy  thermal-mechanical fatigue  fracture characteristic  oxidation behavior  damage mechanism  
Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current 期刊论文
Journal of Applied Physics, 2014, 卷号: 116, 期号: 10
作者:  X. M. Luo;  B. Zhang;  G. P. Zhang
收藏  |  浏览/下载:169/0  |  提交时间:2015/01/14
Molecular-dynamics Simulation  Fine-grained Materials  Thermal Fatigue  Damage  Deformation-behavior  Cu Interconnects  Current Stress  Electromigration  Films  Technology  Diffusion  
Effect of Re on the precipitation behavior of mu phase in several single crystal superalloys 期刊论文
Journal of Alloys and Compounds, 2012, 卷号: 536, 页码: 41474
作者:  K. Cheng;  C. Jo;  T. Jin;  Z. Q. Hu
收藏  |  浏览/下载:155/0  |  提交时间:2013/02/05
Nickel-base Single Crystal Superalloy  Topologically Close Packed Phase  Mu Phase  Thermal Exposure  Nickel-based Superalloys  Creep  Mechanisms  Fatigue  Damage  
Precipitation behavior of mu phase and creep rupture in single crystal superalloy CMSX-4 期刊论文
Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 25, 页码: 7078-7086
作者:  K. Cheng;  C. Jo;  T. Jin;  Z. Q. Hu
Adobe PDF(1648Kb)  |  收藏  |  浏览/下载:171/0  |  提交时间:2012/04/13
Nickel-base Single Crystal Superalloy  Topologically Close Packed Phase  Thermal Exposure  Creep  Nickel-base Superalloys  Ni  Deformation  Microstructure  Mechanisms  Diffusion  Exposure  Fatigue  Design  Damage  
Scaling of reliability of gold interconnect lines subjected to alternating current 期刊论文
Applied Physics Letters, 2011, 卷号: 99, 期号: 1
作者:  M. Wang;  B. Zhang;  G. P. Zhang;  C. S. Liu
Adobe PDF(1299Kb)  |  收藏  |  浏览/下载:98/0  |  提交时间:2012/04/13
Thermal Fatigue Damage  Thin Metal-films  Fracture Surfaces  Behavior  Failure  
Thermomechanical fatigue behavior of an air plasma sprayed thermal barrier coating system 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 29-30, 页码: 8396-8401
作者:  Z. B. Chen;  Z. G. Wang;  S. J. Zhu
Adobe PDF(1065Kb)  |  收藏  |  浏览/下载:94/0  |  提交时间:2012/04/13
Thermal Barrier Coating  Thermomechanical Fatigue  Air Plasma Spraying  Mechanical Fatigue  Damage Mechanisms  Superalloy  Evolution  Life  
Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects 期刊论文
Scripta Materialia, 2009, 卷号: 60, 期号: 4, 页码: 228-231
作者:  J. Zhang;  J. Y. Zhang;  G. Liu;  Y. Zhao;  X. D. Ding;  G. P. Zhang;  J. Sun
Adobe PDF(197Kb)  |  收藏  |  浏览/下载:127/0  |  提交时间:2012/04/13
Thermal Fatigue  Thin Films  Copper-films  Electromigration  Lifetime  Damage  
Failure behavior of coated nickel-based superalloy under thermomechanical fatigue 期刊论文
Journal of Materials Science, 2009, 卷号: 44, 期号: 23, 页码: 6251-6257
作者:  Z. B. Chen;  Z. W. Huang;  Z. G. Wang;  S. J. Zhu
Adobe PDF(386Kb)  |  收藏  |  浏览/下载:78/0  |  提交时间:2012/04/13
Thermal Barrier Coatings  Low-cycle-fatigue  Oxidation Behavior  Isothermal Fatigue  Crack-propagation  Bond Coat  Hvof  Systems  Damage  Life  
Electric Current-induced Failure of 200-nm-thick Gold Interconnects 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 6, 页码: 895-898
作者:  B. Zhang;  Q. Y. Yu;  J. Tan;  G. P. Zhang
Adobe PDF(851Kb)  |  收藏  |  浏览/下载:141/0  |  提交时间:2012/04/13
Au Interconnect  Electric Current  Thermal Fatigue  Failure  Thin Copper-films  Bamboo Al  Electromigration  Mechanisms  Damage