IMR OpenIR
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
Cao Lihua1; Chen Yinbo1,2; Shi Qiyuan1; Yuan Jie1,2; Liu Zhiquan1,2,3
Corresponding AuthorLiu Zhiquan(zqliu@siat.ac.cn)
2019-12-11
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume55Issue:12Pages:1606-1614
AbstractThe eutectic Sn-Ag-Cu (SAC) alloy is the most widely used solder alloy in consuming electronic devices owing to its good wettability and mechanical properties. However, the growth of automotive electronics working at a higher temperature than consuming electronics, requires more reliable solder alloy during microelectronic packaging, which can be achieved by elemental alloying. In this work, the modified Sn-Ag-Cu alloy with Ni, Sb and Bi addition was soldered on the surface of NiSn, NiAu and NiPdAu coating layer respectively, and the effects of elemental addition on the interfacial microstructure and shear strength were investigated systematically. It was found that compared to the commercial SAC305 solder joint, the modified Sn-Ag-Cu solder joint has a thinner interfacial IMC layer while a higher shear strength under the same reflowing conditions, although the formed IMC species are all (Cu, Ni)(6)Sn-5 at both the chip side and the printed circuit board (PCB) sides. The addition of Ni, Sb and Au elements can reduce the IMC growth rate, while the addition of Pd increases the IMC growth. For the same solder alloy and reflowing process, the thickness of IMC layer on NiPdAu is the largest, while that on NiAu coating layer is the smallest. Au or Pd addition in the coating layer affects the distribution of Ag3Sn from dispersive particles to net-like morphology, resulting in an improvement of solder shear strength. The addition of Ag and Cu elements can increase the volume proportion of (Cu, Ni)(6)Sn-5 and Ag3Sn in the solder alloy, hence to increase the shear strength of the solder joints. The solution and precipitation of Bi in the solder alloy can also contribute to the higher shear strength of the modified Sn-Ag-Cu solder joint, although its melting point is decreased to about 213 degrees C. Therefore, the shear strength of modified solder alloy with Ni, Sb and Bi elements is higher than that of commercial SAC305.
Keywordalloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength
Funding OrganizationNational Key Research and Development Program of China
DOI10.11900/0412.1961.2019.00033
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program of China[2017YFB0305700]
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000497774900014
PublisherSCIENCE PRESS
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/136130
Collection中国科学院金属研究所
Corresponding AuthorLiu Zhiquan
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China
3.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Guangdong, Peoples R China
Recommended Citation
GB/T 7714
Cao Lihua,Chen Yinbo,Shi Qiyuan,et al. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. ACTA METALLURGICA SINICA,2019,55(12):1606-1614.
APA Cao Lihua,Chen Yinbo,Shi Qiyuan,Yuan Jie,&Liu Zhiquan.(2019).Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder.ACTA METALLURGICA SINICA,55(12),1606-1614.
MLA Cao Lihua,et al."Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder".ACTA METALLURGICA SINICA 55.12(2019):1606-1614.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Cao Lihua]'s Articles
[Chen Yinbo]'s Articles
[Shi Qiyuan]'s Articles
Baidu academic
Similar articles in Baidu academic
[Cao Lihua]'s Articles
[Chen Yinbo]'s Articles
[Shi Qiyuan]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Cao Lihua]'s Articles
[Chen Yinbo]'s Articles
[Shi Qiyuan]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.