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| Ag/CdS heterostructural composites: Fabrication, characterizations and photocatalysis 期刊论文
Applied Surface Science, 2014, 卷号: 313, 页码: 558-562
作者: Y. Liu; M. Chi; H. L. Dong; H. S. Jia; B. S. Xu; Z. X. Zhang
  收藏 | 浏览/下载：126/0 | 提交时间：2015/01/14
Cds Ag/cds Methylene Blue Photocatalytic Efficiency Single-crystal Cds Cadmium-sulfide Nanotube Arrays Shell Thickness Quantum Dots Nanoparticles Nanostructures Nanocrystals Reduction Nanowires |
| Theoretical studies on the SH parameters and local distortion structure of KCl:Ag(2+) crystal 期刊论文
Physica B-Condensed Matter, 2011, 卷号: 406, 期号: 1, 页码: 56-58
作者: W. L. Li; X. M. Li; W. L. Feng; W. J. Yang; C. Y. Tao
Adobe PDF(131Kb) | 收藏 | 浏览/下载：88/0 | 提交时间：2012/04/13
Crystal- And ligAnd-field Theory Spin-hamiltonian (Sh) Parameters Distortion Structure Ag(2+) Kcl Spin-hamiltonian Parameters Atomic Screening Constants Single-crystals Paramagnetic-resonance Epr Parameters Scf Functions Ions Spectra Field Temperature |
| Effect of orientation on cyclic stress-strain curves and dislocation patterns of Ag and Cu single crystals 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 9, 页码: 2305-2312
作者: P. Li; Z. F. Zhang; S. X. Li; Z. G. Wang
Adobe PDF(1457Kb) | 收藏 | 浏览/下载：145/0 | 提交时间：2012/04/13
Ag Single Crystal Cu Single Crystal Orientation Cyclic Deformation Persistent Slip Bands (Psbs) Dislocation Patterns Electron Channeling Contrast Double Slip Orientation Deformation-behavior Stereographic Triangle Fatigued Copper Bands Side Localization Arrangements Bicrystal |
| Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者: P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏 | 浏览/下载：80/0 | 提交时间：2012/04/13
In Situ Tem Straining Single Crystal Sn Slip System Self-diffusion Crack Propagation Free Solder Alloys Lead-free Solders Thermal Fatigue Behavior Creep Tin Pb Joints Ag Deformation |
| Dislocation arrangements in cyclically deformed Au single crystal 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 23, 页码: 6244-6247
作者: P. Li; S. X. Li; Z. G. Wang; Z. F. Zhang
Adobe PDF(380Kb) | 收藏 | 浏览/下载：86/0 | 提交时间：2012/04/13
Au Single Crystal Cyclic Deformation Persistent Slip Bands Dislocation Arrangements Deformation-behavior Strain Localization Fatigue Copper Slip Orientation Ag |
| Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
作者: H. F. Zou; Z. F. Zhang
Adobe PDF(2393Kb) | 收藏 | 浏览/下载：106/0 | 提交时间：2012/04/13
Ag Single Crystal Substrate Lead-free Solder Intermetallic Compounds (Imcs) Growth Kinetics Local Cracks Lead-free Solders Electroless Ni(p) Metallization Intermetallic Compound Cu-sn Joints Ni Bi Nanoindentation Microstructure Wt.percent |
| Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文
Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662
作者: H. F. Zou; H. J. Yang; Z. F. Zhang
Adobe PDF(4272Kb) | 收藏 | 浏览/下载：105/0 | 提交时间：2012/04/13
Cu Single Crystal Orientation Intermetallic Compounds (Imcs) Coarsening Mechanism Growth Kinetics Lead-free Solders Interfacial Reactions Eutectic Snpb Joints Microstructure Sn-3.5ag Sn-0.7cu Copper |
| Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
作者: H. F. Zou; Q. S. Zhu; Z. F. Zhang
Adobe PDF(1268Kb) | 收藏 | 浏览/下载：79/0 | 提交时间：2012/04/13
Ag Single Crystal Substrate Sn-3.8ag-0.7cu Solder Intermetallic Compounds (Imcs) Growth Kinetics Tensile Strength Fracture Lead-free Solder Interfacial Reaction Cu-substrate Microstructure Metallization Sn-3.5ag Bump Ni Strength Pb |
| Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07. 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 卷号: 435, 页码: 588-594
作者: Zhu, Q. S.; Zhang, Z. F.; Shang, J. K.; Wang, Z. G.
收藏 | 浏览/下载：78/0 | 提交时间：2021/02/02
Sn-Ag-Cu solder copper single crystal intermetallic compounds (IMCs) interface cyclic deformation persistent slip bands (PSBs) fatigue cracking |
| Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 卷号: 435, 页码: 588-594
作者: Q. S. Zhu; Z. F. Zhang; J. K. Shang; Z. Wang
收藏 | 浏览/下载：124/0 | 提交时间：2012/04/14
Sn-ag-cu Solder Copper Single Crystal Intermetallic Compounds (Imcs) Interface Cyclic Deformation Persistent Slip Bands (Psbs) Fatigue Cracking Persistent Slip Bands Pb-free Solders Intermetallic Compounds Cyclic Deformation Joints Behavior Growth Microstructure Evolution Strength |
