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Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires 期刊论文
ADVANCED ENGINEERING MATERIALS, 2022, 页码: 13
作者:  Sun, Pengfei;  Li, Zhiwei;  Hou, Jiapeng;  Xu, Aimin;  Wang, Qiang;  Zhang, Yi;  Zhang, Zhenjun;  Zhang, Penglin;  Zhang, Zhefeng
收藏  |  浏览/下载：115/0  |  提交时间：2022/07/01
annealing  electrical conductivity  microstructure evolution  oxygen-free copper wire  strength  
Formation of nanolaminated structure in an interstitial-free steel 期刊论文
Scripta Materialia, 2015, 卷号: 95, 页码: 54-57
作者:  X. C. Liu;  H. W. Zhang;  K. Lu
收藏  |  浏览/下载：152/0  |  提交时间：2015/01/14
Nanolaminated Structure  Interstitial-free Steel  Surface Mechanical  Grinding Treatment  Grain Refinement  Plastic Deformation  Severe Plastic-deformation  Mechanical Attrition Treatment  Grain-refinement  Surface-layer  If-steel  Strain  Copper  Fe  Microstructure  Evolution  
Structural Changes in Iron Oxide and Gold Catalysts during Nucleation of Carbon Nanotubes Studied by In Situ Transmission Electron Microscopy 期刊论文
Acs Nano, 2014, 卷号: 8, 期号: 1, 页码: 292-301
作者:  D. M. Tang;  C. Liu;  W. J. Yu;  L. L. Zhang;  P. X. Hou;  J. C. Li;  F. Li;  Y. Bando;  D. Golberg;  H. M. Cheng
收藏  |  浏览/下载：132/0  |  提交时间：2014/03/14
Carbon Nanotube  Nucleation  Growth Mechanism  Catalyst  In Situ  Electron Microscopy  Diameter-controlled Synthesis  Chemical-vapor-deposition  Nanoparticle  Catalysts  Selective Synthesis  Metal-catalysts  Small Particles  Silicon-wafers  Free Growth  Aluminum  Copper  
Repeated Growth-Etching-Regrowth for Large-Area Defect-Free Single-Crystal Graphene by Chemical Vapor Deposition 期刊论文
Acs Nano, 2014, 卷号: 8, 期号: 12, 页码: 12806-12813
作者:  T.;  Ren Ma, W. C.;  Liu, Z. B.;  Huang, L.;  Ma, L. P.;  Ma, X. L.;  Zhang, Z. Y.;  Peng, L. M.;  Cheng, H. M.
收藏  |  浏览/下载：121/0  |  提交时间：2015/05/08
Graphene  Single Crystal  Large Size  Defect Free  Chemical Vapor  Deposition  Thin Carbon-films  Grain-boundaries  Polycrystalline Graphene  Controllable Synthesis  Monolayer Graphene  Bilayer Graphene  Copper  Surface  Strength  Graphitization  Hydrogen  
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
作者:  L. M. Yang;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：88/0  |  提交时间：2013/02/05
Solder Joint  Interfaces  Intermetallic Compounds  Fracture  Shear  Strength  Lead-free Solder  Brazed Joints  Size  Sn  Microstructure  Deformation  Reliability  Failure  Copper  Cu  
Porous polymer supported palladium catalyst for cross coupling reactions with high activity and recyclability 期刊论文
Science China-Chemistry, 2012, 卷号: 55, 期号: 10, 页码: 2095-2103
作者:  Q. Sun;  L. F. Zhu;  Z. H. Sun;  X. J. Meng;  F. S. Xiao
收藏  |  浏览/下载：108/0  |  提交时间：2013/02/05
Heterogenous Catalysis  Pd  Coupling Reactions  Nanoporous Polymers  Phase-transfer Catalysis  Heck Reaction  Heterogeneous Palladium  Aryl  Chlorides  Suzuki Reaction  Modified Zeolites  Activated Carbon  Ionic-liquid  Copper-free  Water  
Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文
Journal of Materials Science, 2009, 卷号: 44, 期号: 1, 页码: 149-153
作者:  C. Liu;  W. Zhang
Adobe PDF(311Kb)  |  收藏  |  浏览/下载：123/0  |  提交时间：2012/04/13
Lead-free Solders  Interfacial Reactions  Copper  Segregation  Embrittlement  
Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate 期刊论文
Scripta Materialia, 2009, 卷号: 61, 期号: 3, 页码: 308-311
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(352Kb)  |  收藏  |  浏览/下载：71/0  |  提交时间：2012/04/13
Bi Interfacial Segregation  Embrittlement  Pb-free Solder  Interfacial  Strength  Soldering  Copper Grain-boundaries  Fracture  Boron  Chemistry  Ni3al  
An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 129-136
作者:  M. Sang;  K. Du;  H. Q. Ye
Adobe PDF(1394Kb)  |  收藏  |  浏览/下载：107/0  |  提交时间：2012/04/13
Intermetallics  Crystal Structure  Cu(3)Sn  Transmission Electron  Microscopy  Pb-free Solders  Interfacial Reactions  High-resolution  Tin-lead  Intermetallics  Copper  Contrast  Nanoindentation  Interconnects  Kinetics  
A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction 期刊论文
Journal of Applied Physics, 2009, 卷号: 106, 期号: 11
作者:  H. F. Zou;  H. J. Yang;  Z. F. Zhang
Adobe PDF(486Kb)  |  收藏  |  浏览/下载：88/0  |  提交时间：2012/04/13
Ageing  Copper  Copper Alloys  Electron Backscattering  Electron  Diffraction  Texture  Tin Alloys  Wetting  Lead-free Solders  Interfacial Reactions  Single-crystal  Molten Sn  Growth  Joints