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Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1143-1147
作者:  W. Liu;  L. Zhang;  K. J. Hsia;  J. K. Shang
Adobe PDF(773Kb)  |  收藏  |  浏览/下载：71/0  |  提交时间：2012/04/13
Wetting  Reactive Wetting  Spreading  Solder  Thin Film Pattern  Liquid  Film  Morphological Wetting Transitions  Structured Surfaces  Eutectic Snpb  Films  
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(363Kb)  |  收藏  |  浏览/下载：84/0  |  提交时间：2012/04/13
Electromigration  Coupling Effect  Polarity  Intermetallic Compound  Interfacial Reaction  Zn Based Solders  Ni-p/au Layer  Cross-interaction  Intermetallic  Compounds  Bump Metallization  Eutectic Snpb  Sn-9zn Solder  Cu  Joints  Combination  
Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文
Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662
作者:  H. F. Zou;  H. J. Yang;  Z. F. Zhang
Adobe PDF(4272Kb)  |  收藏  |  浏览/下载：105/0  |  提交时间：2012/04/13
Cu Single Crystal  Orientation  Intermetallic Compounds (Imcs)  Coarsening Mechanism  Growth Kinetics  Lead-free Solders  Interfacial Reactions  Eutectic Snpb  Joints  Microstructure  Sn-3.5ag  Sn-0.7cu  Copper  
Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 2006, 卷号: 435, 435, 页码: 638-647, 638-647
作者:  L. Xu;  Y. Y. Cui;  Y. L. Hao;  R. Yang
收藏  |  浏览/下载：89/0  |  提交时间：2012/04/14
Growth Behavior  Growth Behavior  Tial3 Layer  Tial3 Layer  Ti/al Diffusion Couples  Ti/al Diffusion Couples  Phase Prediction  Phase Prediction  Titanium-aluminum System  Titanium-aluminum System  Phase Formation Sequence  Phase Formation Sequence  Thin-film Systems  Thin-film Systems  Ti-al System  Ti-al System  Soldering Reaction  Soldering Reaction  Mil Composites  Mil Composites  Formation Rule  Formation Rule  Effective Heat  Effective Heat  Eutectic Snpb  Eutectic Snpb  Tial3 Layer  Tial3 Layer  
Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect 期刊论文
Journal of Electronic Materials, 2005, 卷号: 34, 期号: 11, 页码: 1363-1367
作者:  Q. L. Yang;  J. K. Shang
收藏  |  浏览/下载：73/0  |  提交时间：2012/04/14
Electromigration  Solder  Interconnect  Interface  Eutectic Snpb  Electromigration