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Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi 期刊论文
THIN SOLID FILMS, 2023, 卷号: 777, 页码: 9
作者:  Li, Ronghui;  Guan, Yishan;  Fan, Qinna
收藏  |  浏览/下载：6/0  |  提交时间：2024/01/07
Growth stress  Brass  Thin film  Bismuth  Stacking faults  Cracking  Crack free  Electrodeposition  
Catalyst-Free Growth of Atomically Thin Bi2O2Se Nanoribbons for High-Performance Electronics and Optoelectronics 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2021, 页码: 7
作者:  Khan, Usman;  Tang, Lei;  Ding, Baofu;  Yuting, Luo;  Feng, Simin;  Chen, Wenjun;  Khan, Muhammad Jahangir;  Liu, Bilu;  Cheng, Hui-Ming
收藏  |  浏览/下载：126/0  |  提交时间：2021/10/15
Bi  O-2  Se-2  catalyst‐  free growth  chemical vapor deposition  field‐  effect transistor  monolayer nanoribbons  photodetectors  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：137/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Mechanical response of Ti-based bulk metallic glass under plate-impact compression 期刊论文
INTERMETALLICS, 2015, 卷号: 63, 页码: 12-18
作者:  Wang, B. P.;  Wang, L.;  Wang, S.;  Fan, Q. B.;  Xue, Y. F.;  Zhang, H. F.;  Fu, H. M.;  xueyunfei@bit.edu.cn
收藏  |  浏览/下载：105/0  |  提交时间：2016/04/21
Metallic Glasses  Mechanical Properties  Void Formation And Growth  Deformation Map  Free Volume  Microstructure  
Structural Changes in Iron Oxide and Gold Catalysts during Nucleation of Carbon Nanotubes Studied by In Situ Transmission Electron Microscopy 期刊论文
Acs Nano, 2014, 卷号: 8, 期号: 1, 页码: 292-301
作者:  D. M. Tang;  C. Liu;  W. J. Yu;  L. L. Zhang;  P. X. Hou;  J. C. Li;  F. Li;  Y. Bando;  D. Golberg;  H. M. Cheng
收藏  |  浏览/下载：132/0  |  提交时间：2014/03/14
Carbon Nanotube  Nucleation  Growth Mechanism  Catalyst  In Situ  Electron Microscopy  Diameter-controlled Synthesis  Chemical-vapor-deposition  Nanoparticle  Catalysts  Selective Synthesis  Metal-catalysts  Small Particles  Silicon-wafers  Free Growth  Aluminum  Copper  
Statistical mechanics approach to a general hyperbranched polymer system consisting of AB(g) monomers and C-f cores 期刊论文
Polymer, 2014, 卷号: 55, 期号: 2, 页码: 686-697
作者:  Z. F. Zhao;  Y. F. Li;  N. Yao;  H. J. Wang;  X. W. Ba
收藏  |  浏览/下载：133/0  |  提交时间：2014/03/14
Free Equilibrium Energy  Unequal Reactivity  Mean Square Radius Of  Gyration  Condensing Vinyl Polymerization  Molecular-weight Distribution  Mean-square Radii  Conversion Dependence  Multifunctional Core  Branched  Polymers  Kinetic-analysis  Ab(2) Monomer  Step-growth  Ab(n) N=2  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：142/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
作者:  X. J. Wang;  Q. S. Zhu;  B. Liu;  N. Liu;  F. J. Wang
收藏  |  浏览/下载：101/0  |  提交时间：2014/07/03
Lead-free Solder  Intermetallic Compound Growth  Corrosion Behavior  Mechanical-properties  Cu Substrate  Alloy  Microstructure  Reduction  Aluminum  Vacuum  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：101/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者:  L. M. Yang;  Z. F. Zhang
收藏  |  浏览/下载：110/0  |  提交时间：2013/12/24
Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability