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Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
作者:  X. J. Wang;  Q. S. Zhu;  B. Liu;  N. Liu;  F. J. Wang
收藏  |  浏览/下载：100/0  |  提交时间：2014/07/03
Lead-free Solder  Intermetallic Compound Growth  Corrosion Behavior  Mechanical-properties  Cu Substrate  Alloy  Microstructure  Reduction  Aluminum  Vacuum  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者:  L. M. Yang;  Z. F. Zhang
收藏  |  浏览/下载：109/0  |  提交时间：2013/12/24
Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability  
Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
作者:  Q. K. Zhang;  Q. S. Zhu;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2369Kb)  |  收藏  |  浏览/下载：115/0  |  提交时间：2012/04/13
Lead-free Solder  Fatigue Fracture  Interface  Strain Localization  Vertical Cracks  Lead-free Solders  Pb-free Solders  Deformation-behavior  Joints  Tensile  Cu  Embrittlement  Temperature  Sn-3.5ag  Alloy  
Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current 期刊论文
Journal of Materials Research, Journal of Materials Research, 2010, 2010, 卷号: 25, 25, 期号: 6, 页码: 1172-1178, 1172-1178
作者:  H. Y. Liu;  Q. S. Zhu;  L. Zhang;  Z. G. Wang;  J. K. Shang
Adobe PDF(758Kb)  |  收藏  |  浏览/下载：84/0  |  提交时间：2012/04/13
Pb-free Solder  Pb-free Solder  Electromigration-induced Failure  Electromigration-induced Failure  Creep-behavior  Creep-behavior  Joints  Joints  Alloy  Alloy  Sn  Sn  Tin  Tin  Composite  Composite  Mechanism  Mechanism  
Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350
作者:  H. Y. Song;  Q. S. Zhu;  Z. G. Wang;  J. K. Shang;  M. Lu
Adobe PDF(3308Kb)  |  收藏  |  浏览/下载：122/0  |  提交时间：2012/04/13
Lead-free Solder  Sn-ag-cu Alloy  Zn Addition  Tensile Property  Intermetallic Compound  Sn-ag-cu  Free Solder Alloy  Interfacial Reactions  Deformation  Reliability  Joints  Ag3sn  Creep  
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints 期刊论文
Microelectronic Engineering, 2010, 卷号: 87, 期号: 4, 页码: 601-609
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(1205Kb)  |  收藏  |  浏览/下载：83/0  |  提交时间：2012/04/13
Sn-cu Solder  Interfacial Strength  Intermetallic Compounds  Ductile-to-brittle Transition  Strain Rate  Fracture  Lead-free Solders  Intermetallic Compounds  Tensile Properties  Microstructure  Growth  Alloy  
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 11, 页码: 2398-2404
作者:  X. N. Du;  J. D. Guo;  J. K. Shang
Adobe PDF(656Kb)  |  收藏  |  浏览/下载：63/0  |  提交时间：2012/04/13
Electromigration  Solder Joint  Intermetallic Compound  Lead-free Solders  Alloy  Interconnects  Technology  Bump  
Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文
Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(797Kb)  |  收藏  |  浏览/下载：120/0  |  提交时间：2012/04/13
Sn-ag-zn  Lead-free Solder  Gravity  Interfaces  Intermetallic Compounds  Lead-free Solders  Cu Substrate  Bump Metallization  Tensile Properties  Phase-equilibria  Eutectic Alloy  Ni  Behavior  Bi  Microstructure  
Degradation of solderability of electroless nickel by phosphide particles 期刊论文
Surface & Coatings Technology, Surface & Coatings Technology, 2007, 2007, 卷号: 202, 202, 期号: 2, 页码: 268-274, 268-274
作者:  J. J. Guo;  A. P. Man;  J. K. Shang
收藏  |  浏览/下载：86/0  |  提交时间：2012/04/13
Solderability  Solderability  Electroless Nickel  Electroless Nickel  Wetting  Wetting  Pb-free Solder  Pb-free Solder  Snagcu Alloy  Snagcu Alloy  Lead-free Solders  Lead-free Solders  State Interfacial Reaction  State Interfacial Reaction  Ni-plated Kovar  Ni-plated Kovar  Ag-cu  Ag-cu  Solders  Solders  Intermetallic Compounds  Intermetallic Compounds  Mechanical-properties  Mechanical-properties  Bump  Bump  Metallization  Metallization  Microstructure  Microstructure  Copper  Copper  Wettability  Wettability  
Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy 期刊论文
ACTA METALLURGICA SINICA, 2007, 卷号: 43, 期号: 1, 页码: 41-46
作者:  Zhu Qingsheng;  Zhang Li;  Wang Zhongguang;  Wu Shiding;  Shang Jianku
收藏  |  浏览/下载：72/0  |  提交时间：2021/02/02
Pb-free solder  Sn3.8Ag0.7Cu alloy  intermetallics  equal channel angular pressing  mechanical property