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Fabrication of ultrafine-grained Cu-Mn alloy with uniform microstructure and high mechanical properties 期刊论文
MATERIALS CHARACTERIZATION, 2023, 卷号: 205, 页码: 7
作者:  Liu, M.;  Yang, J. X.;  Wang, Y. D.;  Dong, X. G.;  Xue, P.;  Wu, L. H.;  Liu, F. C.;  Ni, D. R.;  Xiao, B. L.;  Ma, Z. Y.
收藏  |  浏览/下载：14/0  |  提交时间：2024/01/07
Cu-Mn alloy  Target materials  Friction stir processing  Equal channel angular pressing  Ultrafine-grained material  Microstructure  
Enhanced strength and ductility in friction stir processed Cu-Mn alloys 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 卷号: 24, 页码: 2458-2468
作者:  Yang, J. X.;  Liu, M.;  Dong, X. G.;  Liu, F. C.;  Wu, L. H.;  Xue, P.;  Ni, D. R.;  Ma, Z. Y.
收藏  |  浏览/下载：16/0  |  提交时间：2024/01/07
China  Friction stir processing  Ultrafine-grained material  Short-range ordering  Microstructure  Cu alloy  
A low-to-high friction transition in gradient nano-grained Cu and Cu-Ag alloys 期刊论文
FRICTION, 2020, 页码: 10
作者:  Chen, Xiang;  Han, Zhong
收藏  |  浏览/下载：237/0  |  提交时间：2021/02/02
gradient nano-grained metals  Cu and Cu-Ag alloy  low-to-high friction transition  subsurface plastic deformation  wear  
Improved cyclic softening behavior of ultrafine-grained Cu with high microstructural stability 期刊论文
SCRIPTA MATERIALIA, 2019, 卷号: 166, 页码: 10-14
作者:  Xue, P.;  Wang, B. B.;  An, X. H.;  Ni, D. R.;  Xiao, B. L.;  Ma, Z. Y.
收藏  |  浏览/下载：219/0  |  提交时间：2021/02/02
Friction stir processing  Ultrafine-grained Cu  Cyclic softening  Stable microstructures  Low-cycle fatigue life  
Thickness-related synchronous increase in strength and ductility of ultrafine-grained pure aluminum sheets 期刊论文
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2019, 卷号: 26, 期号: 11, 页码: 1450-1456
作者:  Yan Ying;  Zhang Guoqiang;  Chen Lijia;  Li Xiaowu
收藏  |  浏览/下载：141/0  |  提交时间：2021/02/02
STACKING-FAULT ENERGIES  CU-MN ALLOYS  DEFORMATION-BEHAVIOR  SPECIMEN DIMENSIONS  TENSILE BEHAVIOR  MICRO-EXTRUSION  STRAIN-RATE  SIZE  OPTIMIZATION  TEMPERATURE  ultrafine-grained pure Al  specimen size effect  strength  ductility  
Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via 期刊论文
MATERIALS, 2018, 卷号: 11, 期号: 2, 页码: -
作者:  Sun, FL;  Liu, ZQ;  Li, CF;  Zhu, QS;  Zhang, H;  Suganuma, K;  Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：109/0  |  提交时间：2018/06/05
Columnar-grained Cu  Twins  Boundaries  Nanoscale  Strength  Behavior  Joints  
Extremely-low-cycle fatigue behaviors of Cu and Cu-Al alloys: Damage mechanisms and life prediction 期刊论文
Acta Materialia, 2015, 卷号: 83, 页码: 341-356
作者:  R.;  Zhang Liu, Z. J.;  Zhang, P.;  Zhang, Z. F.
收藏  |  浏览/下载：141/0  |  提交时间：2015/05/08
Extremely-low-cycle Fatigue  Cyclic Hardening  Fatigue Crack  Hysteresis  Energy  Damage Mechanism  Stacking-fault Energy  Ductile Crack Initiation  Ultrafine-grained Cu  Microstructural Evolution  Hysteresis Energy  Steel  Strain  Deformation  Assessments  Transition  
Enhanced cyclic deformation responses of ultrafine-grained Cu and nanocrystalline Cu-Al alloys 期刊论文
Acta Materialia, 2014, 卷号: 74, 页码: 200-214
作者:  X. H. An;  S. D. Wu;  Z. G. Wang;  Z. F. Zhang
收藏  |  浏览/下载：108/0  |  提交时间：2015/01/14
Ultrafine-grained Cu  Nanocrystalline Cu-al Alloys  Stacking Fault  Energy  Cyclic Softening  Fatigue Damage Mechanism  Severe Plastic-deformation  Stacking-fault Energy  Crack Growth  Resistance  Stress-strain Response  High-pressure Torsion  Microstructural Evolution  Fatigue Behavior  Mechanical-properties  Nanostructured Cu  Copper  
Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current 期刊论文
Journal of Applied Physics, 2014, 卷号: 116, 期号: 10
作者:  X. M. Luo;  B. Zhang;  G. P. Zhang
收藏  |  浏览/下载：167/0  |  提交时间：2015/01/14
Molecular-dynamics Simulation  Fine-grained Materials  Thermal Fatigue  Damage  Deformation-behavior  Cu Interconnects  Current Stress  Electromigration  Films  Technology  Diffusion  
Tension-induced softening and hardening in gradient nanograined surface layer in copper 期刊论文
Scripta Materialia, 2014, 卷号: 77, 页码: 17-20
作者:  T. H. Fang;  N. R. Tao;  K. Lu
收藏  |  浏览/下载：174/0  |  提交时间：2014/07/03
Hardness Test  Grain Growth  Grain Refinement  Gradient Nanograined  (Gng) Structure  Copper  Severe Plastic-deformation  Microstructural Evolution  Cryogenic  Temperature  Thermal-stability  Room-temperature  Grained Copper  Nanocrystalline  Nickel  Cu  Refinement