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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：137/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles 期刊论文
MATERIALS CHARACTERIZATION, 2018, 卷号: 136, 页码: 94-99
作者:  Yuan, J;  Li, CF;  Yang, B;  Liu, ZQ;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：101/0  |  提交时间：2018/06/05
High Saturation Magnetization  Interfacial Reliability  Alloys  Temperature  Fabrication  Relaxation  
Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890
作者:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru;  Nagao Shijo;  Suganuma Katsuaki
收藏  |  浏览/下载：146/0  |  提交时间：2021/02/02
NI SOLDER JOINTS  NANO-SCALE TWINS  INTERFACIAL RELIABILITY  FE-NI  COPPER  METALS  DEFORMATION  STRENGTH  DEPENDENCE  BOUNDARIES  Electrodeposition  Nanotwinned Cu  Growth mechanism  Acid adsorption  
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
作者:  F. F. Tian;  Z. Q. Liu
收藏  |  浏览/下载：143/0  |  提交时间：2014/03/14
48sn52in  Imc  Morphology  Orientation Relationship  Ebsd  Interfacial Reactions  Soldering Reaction  Joint Reliability  Void  Formation  Solid-state  Sn  Cu3sn  Alloy  Creep  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者:  L. M. Yang;  Z. F. Zhang
收藏  |  浏览/下载：110/0  |  提交时间：2013/12/24
Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability  
Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350
作者:  H. Y. Song;  Q. S. Zhu;  Z. G. Wang;  J. K. Shang;  M. Lu
Adobe PDF(3308Kb)  |  收藏  |  浏览/下载：128/0  |  提交时间：2012/04/13
Lead-free Solder  Sn-ag-cu Alloy  Zn Addition  Tensile Property  Intermetallic Compound  Sn-ag-cu  Free Solder Alloy  Interfacial Reactions  Deformation  Reliability  Joints  Ag3sn  Creep  
Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(1170Kb)  |  收藏  |  浏览/下载：86/0  |  提交时间：2012/04/13
Intermetallic Compound  Electroless Ni-p  Interfacial Reaction  Zn  Addition  Tin  Lead-free Solders  Interfacial Reactions  Cu Substrate  Metallization  Joints  Reliability  Growth  Microstructure  Packages  Alloys