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Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345
作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping
收藏  |  浏览/下载：128/0  |  提交时间：2021/02/02
Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion  
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
作者:  F. F. Tian;  P. J. Shang;  Z. Q. Liu
收藏  |  浏览/下载：194/0  |  提交时间：2014/07/03
Interfaces  Intermetallic Alloys And Compounds  Diffusion  Kirkendall  Void  Snin Solder  Cu Substrate  Growth-kinetics  Snagcu Solder  Diffusion  Compound  Identification  Ni  
Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
作者:  X. J. Wang;  Q. S. Zhu;  B. Liu;  N. Liu;  F. J. Wang
收藏  |  浏览/下载：102/0  |  提交时间：2014/07/03
Lead-free Solder  Intermetallic Compound Growth  Corrosion Behavior  Mechanical-properties  Cu Substrate  Alloy  Microstructure  Reduction  Aluminum  Vacuum  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：103/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints 期刊论文
Journal of Applied Physics, 2013, 卷号: 114, 期号: 15
作者:  J. Q. Chen;  J. D. Guo;  K. L. Liu;  J. K. Shang
收藏  |  浏览/下载：93/0  |  提交时间：2013/12/24
Intermetallic Compound Formation  Diffusion  Tin  Interconnect  Growth  Metals  Gold  
Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文
Journal of Alloys and Compounds, Journal of Alloys and Compounds, 2011, 2011, 卷号: 509, 509, 期号: 5, 页码: 1785-1789, 1785-1789
作者:  T. Y. Kang;  Y. Y. Xiu;  C. Z. Liu;  L. Hui;  J. J. Wang;  W. P. Tong
Adobe PDF(743Kb)  |  收藏  |  浏览/下载：101/0  |  提交时间：2012/04/13
Bi Segregation  Bi Segregation  Interconnect  Interconnect  Kinetics  Kinetics  Intermetallic Compound Growth  Intermetallic Compound Growth  Lead-free Solders  Lead-free Solders  Cu  Cu  
Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(1170Kb)  |  收藏  |  浏览/下载：87/0  |  提交时间：2012/04/13
Intermetallic Compound  Electroless Ni-p  Interfacial Reaction  Zn  Addition  Tin  Lead-free Solders  Interfacial Reactions  Cu Substrate  Metallization  Joints  Reliability  Growth  Microstructure  Packages  Alloys  
Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 6, 页码: 852-859
作者:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
Adobe PDF(644Kb)  |  收藏  |  浏览/下载：136/0  |  提交时间：2012/04/13
Lead-free Solders  Interface  Intermetallic Compounds (Imcs)  Fatigue  Crack  Fractography  Intermetallic Compound  Deformation-behavior  Cu  Microstructure  Evolution  Growth  96.5sn-3.5ag  Temperature  Interfaces  Morphology  
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 12, 页码: 2579-2584
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
Adobe PDF(349Kb)  |  收藏  |  浏览/下载：83/0  |  提交时间：2012/04/13
Intermetallic Compound (Imc)  Snbi Solder  Interface  Diffusion  Growth  Mechanism  Reactive Interface  Solder Joints  Molten Sn  Cu-sn  Technology  Kinetics