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| Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者: M. N. Wang; J. Q. Wang; W. Ke
  收藏 | 浏览/下载：116/0 | 提交时间：2014/04/18
Lead-free Solders 3.5-percent Nacl Solution Electrochemical Corrosion Ga Solder Reliability Surface Alloys Joints Tin Sn |
| Corrosion of Ga-doped Sn-0.7Cu Solder in Simulated Marine Atmosphere 期刊论文
Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2013, 卷号: 44A, 期号: 3, 页码: 1462-1474
作者: Z. Yan; A. P. Xian
收藏 | 浏览/下载：115/0 | 提交时间：2013/12/24
Lead-free Solders Electrochemical Corrosion Whisker Growth Nacl Solution Thin-films Tin Oxidation Behavior Alloys |
| Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Corrosion Science, 2012, 卷号: 63, 页码: 20-28
作者: M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏 | 浏览/下载：75/0 | 提交时间：2013/02/05
Electronic Materials Alloy Sem Xps Atmospheric Corrosion Lead-free Solders Ag-cu Alloys Electrochemical Corrosion Nacl Solution Tin Behavior Microstructure Surface |
| Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者: P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏 | 浏览/下载：80/0 | 提交时间：2012/04/13
In Situ Tem Straining Single Crystal Sn Slip System Self-diffusion Crack Propagation Free Solder Alloys Lead-free Solders Thermal Fatigue Behavior Creep Tin Pb Joints Ag Deformation |
| Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510
作者: X. F. Zhang; J. D. Guo; J. K. Shang
Adobe PDF(1170Kb) | 收藏 | 浏览/下载：87/0 | 提交时间：2012/04/13
Intermetallic Compound Electroless Ni-p Interfacial Reaction Zn Addition Tin Lead-free Solders Interfacial Reactions Cu Substrate Metallization Joints Reliability Growth Microstructure Packages Alloys |
| A study on the orientation relationship between the scallop-type Cu(6)Sn(5) grains and (011) Cu substrate using electron backscattered diffraction 期刊论文
Journal of Applied Physics, 2009, 卷号: 106, 期号: 11
作者: H. F. Zou; H. J. Yang; Z. F. Zhang
Adobe PDF(486Kb) | 收藏 | 浏览/下载：88/0 | 提交时间：2012/04/13
Ageing Copper Copper Alloys Electron Backscattering Electron Diffraction Texture Tin Alloys Wetting Lead-free Solders Interfacial Reactions Single-crystal Molten Sn Growth Joints |
| Effect of Sn concentration on the corrosion resistance of Pb-Sn alloys in H2SO4 solution 期刊论文
Journal of Power Sources, 2006, 卷号: 155, 期号: 2, 页码: 420-427
作者: J. Xu; X. B. Liu; X. G. Li; E. Barbero; C. F. Dong
收藏 | 浏览/下载：93/0 | 提交时间：2012/04/14
Pb-sn Alloy Potentiodynaic Polarization Corrosion Rate Lead-tin Alloys Sulfuric-acid Electrodes Antimony Behavior Calcium Grids Oxide Sb |
| Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method 期刊论文
Journal of Electronic Materials, 2005, 卷号: 34, 期号: 11, 页码: 1414-1419
作者: L. W. Wang; A. P. Xian
收藏 | 浏览/下载：68/0 | 提交时间：2012/04/14
Lead (Pb)-free Solders Density Indirect Archimedean Method Liquid Tin (Sn) Alloys Surface-tension Measurements Free Solders Lead Pb Sn Alloys Bi |
