|
已选(0)清除
条数/页： 排序方式： |
| Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者: Q. K. Zhang; Z. F. Zhang
  收藏 | 浏览/下载：108/0 | 提交时间：2013/12/24
Sn-ag/cu Solder Joints Thermal Fatigue Strain Localization Grain Rotation Dynamic Recovery Stress-relaxation Behavior Eutectic Sn-3.5ag Solder Lead-free Solders Pb-free Solders Sn-ag Tensile Properties Shear-strength Fracture-behavior Deformation Creep |
| Microstructure and growth mechanism of tin whiskers on RESn3 compounds 期刊论文
Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 589-601
作者: C. F. Li; Z. Q. Liu
收藏 | 浏览/下载：101/0 | 提交时间：2013/12/24
Intact Tin Whisker Resn3 Compounds In Situ Transmission Electron Microscopy (Tem) Transmission Electron-microscopy Pb-free Solders Sn-cu Surface Technology Joints Bends |
| Tin Whisker Growth on NdSn(3) Powder 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 9, 页码: 1962-1966
作者: H. C. Shi; A. P. Xian
Adobe PDF(543Kb) | 收藏 | 浏览/下载：124/0 | 提交时间：2012/04/13
Tin Whiskers Rare Earth Intermetallic Compounds Sn Ndsn(3) Pb-free Solders Mechanism |
| In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2667Kb) | 收藏 | 浏览/下载：79/0 | 提交时间：2012/04/13
Snag/cu Solder Joints Creep Fatigue In Situ Observation Strain Localization Grain Subdivision Lead-free Solders Pb-sn Solder Tensile Properties Shear-strength Deformation-behavior Sn-3.5ag Solder Strain-rate Ag Microstructure Alloys |
| In situ investigation on the oxidation behavior of a RESn(3) film by transmission electron microscopy 期刊论文
Scripta Materialia, 2011, 卷号: 65, 期号: 12, 页码: 1049-1052
作者: C. F. Li; Z. Q. Liu; P. J. Shang; J. K. Shang
Adobe PDF(528Kb) | 收藏 | 浏览/下载：119/0 | 提交时间：2012/04/13
Resn(3) Compounds Oxidation Thermodynamics Transmission Electron Microscopy (Tem) Pb-free Solders Whisker Growth Tin Whiskers Surface Joints Alloys |
| Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
作者: Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang
Adobe PDF(2369Kb) | 收藏 | 浏览/下载：117/0 | 提交时间：2012/04/13
Lead-free Solder Fatigue Fracture Interface Strain Localization Vertical Cracks Lead-free Solders Pb-free Solders Deformation-behavior Joints Tensile Cu Embrittlement Temperature Sn-3.5ag Alloy |
| Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者: P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏 | 浏览/下载：80/0 | 提交时间：2012/04/13
In Situ Tem Straining Single Crystal Sn Slip System Self-diffusion Crack Propagation Free Solder Alloys Lead-free Solders Thermal Fatigue Behavior Creep Tin Pb Joints Ag Deformation |
| An ordered structure of Cu(3)Sn in Cu-Sn alloy investigated by transmission electron microscopy 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 129-136
作者: M. Sang; K. Du; H. Q. Ye
Adobe PDF(1394Kb) | 收藏 | 浏览/下载：107/0 | 提交时间：2012/04/13
Intermetallics Crystal Structure Cu(3)Sn Transmission Electron Microscopy Pb-free Solders Interfacial Reactions High-resolution Tin-lead Intermetallics Copper Contrast Nanoindentation Interconnects Kinetics |
| Degradation of solderability of electroless nickel by phosphide particles 期刊论文
Surface & Coatings Technology, Surface & Coatings Technology, 2007, 2007, 卷号: 202, 202, 期号: 2, 页码: 268-274, 268-274
作者: J. J. Guo; A. P. Man; J. K. Shang
收藏 | 浏览/下载：88/0 | 提交时间：2012/04/13
Solderability Solderability Electroless Nickel Electroless Nickel Wetting Wetting Pb-free Solder Pb-free Solder Snagcu Alloy Snagcu Alloy Lead-free Solders Lead-free Solders State Interfacial Reaction State Interfacial Reaction Ni-plated Kovar Ni-plated Kovar Ag-cu Ag-cu Solders Solders Intermetallic Compounds Intermetallic Compounds Mechanical-properties Mechanical-properties Bump Bump Metallization Metallization Microstructure Microstructure Copper Copper Wettability Wettability |
| Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文
Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227
作者: J. K. Shang; Q. L. Zeng; L. Zhang; Q. S. Zhu
收藏 | 浏览/下载：96/0 | 提交时间：2012/04/13
Low-cycle Fatigue Lead-free Solders Crack-growth-behavior Thermal Fatigue 63sn-37pb Solder Eutectic Solder Thermomechanical Fatigue Ag-cu Joints Life |
