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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：126/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：107/0  |  提交时间：2013/12/24
Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2667Kb)  |  收藏  |  浏览/下载：77/0  |  提交时间：2012/04/13
Snag/cu Solder Joints  Creep Fatigue  In Situ Observation  Strain  Localization  Grain Subdivision  Lead-free Solders  Pb-sn Solder  Tensile Properties  Shear-strength  Deformation-behavior  Sn-3.5ag Solder  Strain-rate  Ag  Microstructure  Alloys  
Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
作者:  Q. K. Zhang;  Q. S. Zhu;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2369Kb)  |  收藏  |  浏览/下载：115/0  |  提交时间：2012/04/13
Lead-free Solder  Fatigue Fracture  Interface  Strain Localization  Vertical Cracks  Lead-free Solders  Pb-free Solders  Deformation-behavior  Joints  Tensile  Cu  Embrittlement  Temperature  Sn-3.5ag  Alloy  
Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current 期刊论文
Journal of Materials Research, Journal of Materials Research, 2010, 2010, 卷号: 25, 25, 期号: 6, 页码: 1172-1178, 1172-1178
作者:  H. Y. Liu;  Q. S. Zhu;  L. Zhang;  Z. G. Wang;  J. K. Shang
Adobe PDF(758Kb)  |  收藏  |  浏览/下载：84/0  |  提交时间：2012/04/13
Pb-free Solder  Pb-free Solder  Electromigration-induced Failure  Electromigration-induced Failure  Creep-behavior  Creep-behavior  Joints  Joints  Alloy  Alloy  Sn  Sn  Tin  Tin  Composite  Composite  Mechanism  Mechanism  
Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 3, 页码: 200-205
作者:  W. Liu;  L. Zhang;  J. K. Shang
Adobe PDF(886Kb)  |  收藏  |  浏览/下载：78/0  |  提交时间：2012/04/13
Dewetting  Solder  Spalling  Film Thickness  Sn  Technology  Metallurgy  Joints  Pb  
Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
收藏  |  浏览/下载：79/0  |  提交时间：2012/04/13
In Situ Tem  Straining  Single Crystal Sn  Slip System  Self-diffusion  Crack Propagation  Free Solder Alloys  Lead-free Solders  Thermal Fatigue  Behavior  Creep  Tin  Pb  Joints  Ag  Deformation  
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
作者:  H. F. Zou;  Q. S. Zhu;  Z. F. Zhang
Adobe PDF(1268Kb)  |  收藏  |  浏览/下载：77/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Sn-3.8ag-0.7cu Solder  Intermetallic  Compounds (Imcs)  Growth Kinetics  Tensile Strength  Fracture  Lead-free Solder  Interfacial Reaction  Cu-substrate  Microstructure  Metallization  Sn-3.5ag  Bump  Ni  Strength  Pb  
Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文
Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227
作者:  J. K. Shang;  Q. L. Zeng;  L. Zhang;  Q. S. Zhu
收藏  |  浏览/下载：94/0  |  提交时间：2012/04/13
Low-cycle Fatigue  Lead-free Solders  Crack-growth-behavior  Thermal  Fatigue  63sn-37pb Solder  Eutectic Solder  Thermomechanical Fatigue  Ag-cu  Joints  Life