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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
Favorite  |  View/Download:135/0  |  Submit date:2021/02/02
Sn-Cu  microstructures  IMC  mechanical properties  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
Favorite  |  View/Download:28/0  |  Submit date:2021/02/02
Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
Favorite  |  View/Download:30/0  |  Submit date:2021/02/02
Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
Favorite  |  View/Download:30/0  |  Submit date:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
Favorite  |  View/Download:31/0  |  Submit date:2021/02/02
Materials, processing and reliability of low temperature bonding in 3D chip stacking 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
Authors:  Zhang, Liang;  Liu, Zhi-quan;  Chen, Sinn-Wen;  Wang, Yao-dong;  Long, Wei-Min;  Guo, Yong-huan;  Wang, Song-quan;  Ye, Guo;  Liu, Wen-yi
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3D IC  Low temperature bonding  Bonding method  Reliability  
Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 卷号: 29, 期号: 3, 页码: 151-155
Authors:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan
Favorite  |  View/Download:49/0  |  Submit date:2021/02/02
Alloys  Sn-Ag-Cu  Finite element modeling (FEM)  Reliability