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| Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
作者: F. F. Tian; P. J. Shang; Z. Q. Liu
  收藏 | 浏览/下载：187/0 | 提交时间：2014/07/03
Interfaces Intermetallic Alloys And Compounds Diffusion Kirkendall Void Snin Solder Cu Substrate Growth-kinetics Snagcu Solder Diffusion Compound Identification Ni |
| Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
作者: X. J. Wang; Q. S. Zhu; B. Liu; N. Liu; F. J. Wang
收藏 | 浏览/下载：100/0 | 提交时间：2014/07/03
Lead-free Solder Intermetallic Compound Growth Corrosion Behavior Mechanical-properties Cu Substrate Alloy Microstructure Reduction Aluminum Vacuum |
| Interfacial defects in YBa2Cu3O7-/SrTiO3(001) heterostructures studied by aberration-corrected ultrahigh-resolution electron microscopy 期刊论文
Philosophical Magazine Letters, 2013, 卷号: 93, 期号: 5, 页码: 264-272
作者: S. B. Mi
收藏 | 浏览/下载：113/0 | 提交时间：2013/12/24
Thin Films Atomic-resolution Electron Microscopy Interfacial Structure Cuprate Superconductors Defect Structures Ybco Thin-films Srtio3 Substrate Atomic-structure Yba2cu3o7-delta Growth Superconductors |
| Growth Mechanism of Single-Walled Carbon Nanotubes on Iron-Copper Catalyst and Chirality Studies by Electron Diffraction 期刊论文
Chemistry of Materials, 2012, 卷号: 24, 期号: 10, 页码: 1796-1801
作者: M. S. He; B. L. Liu; A. I. Chernov; E. D. Obraztsova; I. Kauppi; H. Jiang; I. Anoshkin; F. Cavalca; T. W. Hansen; J. B. Wagner; A. G. Nasibulin; E. I. Kauppinen; J. Linnekoski; M. Niemela; J. Lehtonen
收藏 | 浏览/下载：126/0 | 提交时间：2013/02/05
Single-walled Carbon Nanotube Semiconducting Swnts Electron Diffraction Iron-copper Catalyst Preferential Growth Selective Synthesis Fe-cu Nanoparticles Spectroscopy Substrate Diameter Support Mgo |
| Progress of graphene growth on copper by chemical vapor deposition: Growth behavior and controlled synthesis 期刊论文
Chinese Science Bulletin, 2012, 卷号: 57, 期号: 23, 页码: 2995-2999
作者: L. P. Ma; W. C. Ren; Z. L. Dong; L. Q. Liu; H. M. Cheng
收藏 | 浏览/下载：99/0 | 提交时间：2013/02/05
Graphene Controlled Growth Chemical Vapor Deposition Copper Substrate Bilayer Graphene Layer Graphene Films Cu(111) Foils |
| The preparation of c-axis epitaxial Bi-2212 films on STO(100) by sol-gel method 期刊论文
Applied Surface Science, 2011, 卷号: 258, 期号: 1, 页码: 38-43
作者: X. M. Yu; H. Z. Yang; Y. Qi
Adobe PDF(1243Kb) | 收藏 | 浏览/下载：107/0 | 提交时间：2012/04/13
Bi(2)Sr(2)Ca(1)Cu(2)o(8+delta) Films Sto(100) Sol-gel Morphology Intrinsic Josephson-junctions Thin-films Electrical-properties Single-crystals bi2sr2cacu2o8+delta Superconductor Growth Substrate Tapes |
| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P; Liu C Z
收藏 | 浏览/下载：110/0 | 提交时间：2021/02/26
SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 479, 期号: 1-2, 页码: 505-510
作者: X. F. Zhang; J. D. Guo; J. K. Shang
Adobe PDF(1170Kb) | 收藏 | 浏览/下载：84/0 | 提交时间：2012/04/13
Intermetallic Compound Electroless Ni-p Interfacial Reaction Zn Addition Tin Lead-free Solders Interfacial Reactions Cu Substrate Metallization Joints Reliability Growth Microstructure Packages Alloys |
| Fracture mechanism and strength-influencing factors of Cu/Sn-4Ag solder joints aged for different times 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 485, 期号: 1-2, 页码: 853-861
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2505Kb) | 收藏 | 浏览/下载：67/0 | 提交时间：2012/04/13
Sn-4ag Solder Interfacial Imcs Tensile Properties Strain Rate Fracture Mechanism Lead-free Solders Sn-ag Shear-strength Tensile Properties Intermetallic Compound Deformation-behavior Strain-rate Interfacial Reaction Cu Substrate Microstructure |
| Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 487, 期号: 1-2, 页码: 776-780
作者: X. F. Zhang; J. D. Guo; J. K. Shang
Adobe PDF(759Kb) | 收藏 | 浏览/下载：83/0 | 提交时间：2012/04/13
Intermetallics Kinetics Interfacial Reactions Feni Activation Energy Zn Based Solders Ni-p/au Layer Interfacial Reactions Sn-ag Cu Electromigration Interconnect Microstructure Substrate Alloys |
