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Resistance to Molten Superalloy at 1550 degrees C for Molybdenum Metal Core with a Silica/Silicide Coating 期刊论文
COATINGS, 2021, 卷号: 11, 期号: 3, 页码: 11
作者:  Zhang, Chong;  Liu, Enze;  Zheng, Zhi;  Ning, Likui;  Tong, Jian;  Tan, Zheng;  Li, Haiying
收藏  |  浏览/下载：136/0  |  提交时间：2021/10/15
molybdenum metal core  SiO2 layer  Superalloy  interfacial reactions  
Resistance to Molten Superalloy at 1550 degrees C for Molybdenum Metal Core with a Silica/Silicide Coating 期刊论文
COATINGS, 2021, 卷号: 11, 期号: 3, 页码: 11
作者:  Zhang, Chong;  Liu, Enze;  Zheng, Zhi;  Ning, Likui;  Tong, Jian;  Tan, Zheng;  Li, Haiying
收藏  |  浏览/下载：109/0  |  提交时间：2021/10/15
molybdenum metal core  SiO2 layer  Superalloy  interfacial reactions  
Progress in the Regulation of Electrode/Electrolyte Interfacial Reactions toward High-voltage Aqueous Hybrid Capacitors 期刊论文
BATTERIES & SUPERCAPS, 2021, 页码: 17
作者:  Hu, Tianzhao;  Wang, Yuzuo;  Li, Juan;  Chen, Shaorui;  Shi, Ying;  Li, Zhuangnan;  Ruan, Dianbo;  Xu, Qun;  Li, Feng
收藏  |  浏览/下载：158/0  |  提交时间：2021/10/15
high voltage  aqueous hybrid capacitors  regulation strategies  interfacial reactions  electrochemical window  
Progress in the Regulation of Electrode/Electrolyte Interfacial Reactions toward High-voltage Aqueous Hybrid Capacitors 期刊论文
BATTERIES & SUPERCAPS, 2021, 页码: 17
作者:  Hu, Tianzhao;  Wang, Yuzuo;  Li, Juan;  Chen, Shaorui;  Shi, Ying;  Li, Zhuangnan;  Ruan, Dianbo;  Xu, Qun;  Li, Feng
收藏  |  浏览/下载：159/0  |  提交时间：2021/10/15
high voltage  aqueous hybrid capacitors  regulation strategies  interfacial reactions  electrochemical window  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：136/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
作者:  F. F. Tian;  Z. Q. Liu
收藏  |  浏览/下载：142/0  |  提交时间：2014/03/14
48sn52in  Imc  Morphology  Orientation Relationship  Ebsd  Interfacial Reactions  Soldering Reaction  Joint Reliability  Void  Formation  Solid-state  Sn  Cu3sn  Alloy  Creep  
Oxidation and Thermal Shock Behavior of a Glass-Alumina Composite Coating on K38G Superalloy at 1000 degrees C 期刊论文
Journal of Materials Science & Technology, 2012, 卷号: 28, 期号: 5, 页码: 433-438
作者:  M. H. Chen;  M. L. Shen;  X. Wang;  S. L. Zhu;  F. H. Wang
收藏  |  浏览/下载：135/0  |  提交时间：2013/02/05
Micromechanics  Glass-alumina  Nickel Based Superalloys  Oxidation  Precipitation  Ceramic-to-metal  Mechanical-properties  Interfacial Reactions  Resistance  Stress  System  Seals  
Preparation and thermal shock behavior at 1000 degrees C of a glass-alumina-NiCrAlY tri-composite coating on K38G superalloy 期刊论文
Surface & Coatings Technology, 2012, 卷号: 206, 期号: 8-9, 页码: 2566-2571
作者:  M. H. Chen;  M. L. Shen;  S. L. Zhu;  F. H. Wang;  Y. Niu
收藏  |  浏览/下载：96/0  |  提交时间：2013/02/05
Glass Coatings  Superalloys  Thermal Cycling  High Temperature  Corrosion  Interfaces  Hot Corrosion Behavior  Ceramic-to-metal  Interfacial Reactions  Oxidation Behavior  Matrix Composites  Enamel  Resistance  Particles  Fracture  System  
Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing 期刊论文
Journal of Applied Physics, 2011, 卷号: 110, 期号: 1
作者:  Q. K. Zhang;  J. Tan;  Z. F. Zhang
Adobe PDF(1864Kb)  |  收藏  |  浏览/下载：113/0  |  提交时间：2012/04/13
Lead-free Solders  Mechanical-properties  Interfacial Reactions  Deformation-behavior  Joints  Nanoindentation  Sn  Metallization  Toughness  Cu3sn  
Coarsening mechanisms, texture evolution and size distribution of Cu(6)Sn(5) between Cu and Sn-based solders 期刊论文
Materials Chemistry and Physics, 2011, 卷号: 131, 期号: 1-2, 页码: 190-198
作者:  H. F. Zou;  H. J. Yang;  Z. F. Zhang
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：94/0  |  提交时间：2012/04/13
Intermetallic Compounds  Nucleation  Interface  Ebsd  Interfacial Reactions  Microstructure  Metallization  Substrate  Kinetics  Ag