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Structural Reversibility of Nanoscaled Sn Anodes 期刊论文
NANO LETTERS, 2024, 卷号: 24, 期号: 17, 页码: 5332-5341
作者:  Su, Yi;  Lei, Xincheng;  Han, Zhen;  Liu, Haowen;  Xiao, Jianhua;  Su, Yipeng;  Ren, Shuaiyang;  Lin, Yitao;  Hu, Qingmiao;  Yang, Rui;  Zhou, Gang;  Su, Dong;  Zhang, Yuegang
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Sn nanoparticles  in situ TEM  phase transition  structural reversibility  vacancyremoval  
Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces 期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12
作者:  Gao, Zhaoqing;  Wang, Chen;  Gao, Nan;  Guo, Shihao;  Chen, Yinbo;  Chai, Zhenbang;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：107/0  |  提交时间：2022/07/01
Ni-W-graphene coatings  Interfacial reaction barrier  CuGa 2 layer  Ga-21  5In-10Sn liquid alloys  Ni -W solid solution  
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu;  Yao, Kai;  Zhao, Ning;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：105/0  |  提交时间：2022/07/14
Intermetallics  Microstructure  Temperature gradient  Preferred orientation  

Ga-21-5In-10Sn alloys

  Interfaces  
Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9
作者:  Tian, Feifei;  Pang, Xueyong;  Xu, Bo;  Liu, Zhi-Quan
收藏  |  浏览/下载：108/0  |  提交时间：2021/02/02
In-48Sn solder  polycrystalline Cu  Cu-2(In  Sn)  growth orientation  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者:  L. M.;  Zhang Yang, Z. F.
收藏  |  浏览/下载：136/0  |  提交时间：2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles  
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
作者:  F. F. Tian;  Z. Q. Liu
收藏  |  浏览/下载：144/0  |  提交时间：2014/03/14
48sn52in  Imc  Morphology  Orientation Relationship  Ebsd  Interfacial Reactions  Soldering Reaction  Joint Reliability  Void  Formation  Solid-state  Sn  Cu3sn  Alloy  Creep  
Microstructure and growth mechanism of tin whiskers on RESn3 compounds 期刊论文
Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 589-601
作者:  C. F. Li;  Z. Q. Liu
收藏  |  浏览/下载：101/0  |  提交时间：2013/12/24
Intact Tin Whisker  Resn3 Compounds  In Situ  Transmission Electron  Microscopy (Tem)  Transmission Electron-microscopy  Pb-free Solders  Sn-cu  Surface  Technology  Joints  Bends  
In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 3, 页码: 289-292
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：134/0  |  提交时间：2013/02/05
Sn-4ag Solder  In Situ Tensile Creep  Electron Backscatter Diffraction  (Ebsd)  Polygonization  Grains Subdivision  Sn-ag  Stress-relaxation  Fracture-behavior  Thermal Fatigue  Deformation  Grain  Recrystallization  Microstructure  Orientation  Evolution  
In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 530, 页码: 452-461
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(1086Kb)  |  收藏  |  浏览/下载：114/0  |  提交时间：2012/04/13
In-situ Observation  Intermetallic Compounds  Interface  Fracture  Dislocation Pile-up  Cumulative Stress  Lead-free Solders  Intermetallic Compounds  Mechanical-properties  Fatigue Damage  Joints  Sn-3.5ag  Polycrystalline  Interfaces  Morphology  Evolution  
In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2037Kb)  |  收藏  |  浏览/下载：108/0  |  提交时间：2012/04/13
In Situ Observation  Shear  Creep-fatigue  Fracture  Sn-58bi Solder  Grain-boundary Sliding  Lead-free Solders  Sn-bi  Microstructure Evolution  Tensile Properties  Alloys  Deformation  Technology  Metals  Ag