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Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals 期刊论文
MATERIALS LETTERS, 2022, 卷号: 307, 页码: 4
作者:  Gao, Zhaoqing;  Chen, Yinbo;  Wang, Chen;  Yao, Kai;  Chai, Zhenbang;  Ma, Haitao;  Wang, Yunpeng;  Huang, Mingliang
收藏  |  浏览/下载：174/0  |  提交时间：2021/12/09
Crystal growth  Electronic materials  Intermetallic alloys and compounds  Ga-based alloys  Chemical short-range order  
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345
作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping
收藏  |  浏览/下载：128/0  |  提交时间：2021/02/02
Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion  
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：138/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging 期刊论文
Journal of Applied Physics, 2014, 卷号: 115, 期号: 4
作者:  F. F. Tian;  Z. Q. Liu;  J. D. Guo
收藏  |  浏览/下载：116/0  |  提交时间：2014/04/18
Heterogeneous Binary-systems  2 Elementary Substances  Intermetallic  Compounds  Reaction-diffusion  Growth  Layers  Interface  Solders  Joints  Cu3sn  
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
作者:  F. F. Tian;  P. J. Shang;  Z. Q. Liu
收藏  |  浏览/下载：196/0  |  提交时间：2014/07/03
Interfaces  Intermetallic Alloys And Compounds  Diffusion  Kirkendall  Void  Snin Solder  Cu Substrate  Growth-kinetics  Snagcu Solder  Diffusion  Compound  Identification  Ni  
Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
作者:  X. J. Wang;  Q. S. Zhu;  B. Liu;  N. Liu;  F. J. Wang
收藏  |  浏览/下载：102/0  |  提交时间：2014/07/03
Lead-free Solder  Intermetallic Compound Growth  Corrosion Behavior  Mechanical-properties  Cu Substrate  Alloy  Microstructure  Reduction  Aluminum  Vacuum  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：103/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者:  L. M. Yang;  Z. F. Zhang
收藏  |  浏览/下载：111/0  |  提交时间：2013/12/24
Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability  
Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints 期刊论文
Journal of Applied Physics, 2013, 卷号: 114, 期号: 15
作者:  J. Q. Chen;  J. D. Guo;  K. L. Liu;  J. K. Shang
收藏  |  浏览/下载：94/0  |  提交时间：2013/12/24
Intermetallic Compound Formation  Diffusion  Tin  Interconnect  Growth  Metals  Gold