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Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9
作者:  Tian, Feifei;  Pang, Xueyong;  Xu, Bo;  Liu, Zhi-Quan
收藏  |  浏览/下载：108/0  |  提交时间：2021/02/02
In-48Sn solder  polycrystalline Cu  Cu-2(In  Sn)  growth orientation  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：237/0  |  提交时间：2021/02/02
alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
作者:  L. M.;  Zhang Yang, Z. F.
收藏  |  浏览/下载：136/0  |  提交时间：2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者:  L. M. Yang;  Z. F. Zhang
收藏  |  浏览/下载：111/0  |  提交时间：2013/12/24
Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability  
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：108/0  |  提交时间：2013/12/24
Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文
Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216
作者:  H. Y. Liu;  Q. S. Zhu;  Z. G. Wang;  J. D. Guo;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2013/12/24
Intermetallic Compound Formation  Sn-3.8ag-0.7cu Solder  Cu  Microstructure  Joints  
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494
作者:  C. Chen;  L. Zhang;  J. X. Zhao;  L. H. Cao;  J. K. Shang
收藏  |  浏览/下载：179/0  |  提交时间：2013/02/05
Solder  Size Effect  Shear Strength  Microstructure  Lead-free Solder  Fatigue-crack Initiation  Sn-ag  Fe-42ni  Ni  Cu  
Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：118/0  |  提交时间：2013/02/05
Sn-bi Solder  Void  Cu3sn  Bi Segregation  Interfacial Embrittlement  Cu  Alloys  Solder Interconnect  Grain-boundaries  Single-crystal  Bismuth  Embrittlement  Segregation  Copper  Strength  
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
作者:  L. M. Yang;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：89/0  |  提交时间：2013/02/05
Solder Joint  Interfaces  Intermetallic Compounds  Fracture  Shear  Strength  Lead-free Solder  Brazed Joints  Size  Sn  Microstructure  Deformation  Reliability  Failure  Copper  Cu  
PITTING CORROSION BEHAVIOR OF Sn-0.7Cu LEAD-FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga 期刊论文
ACTA METALLURGICA SINICA, 2011, 卷号: 47, 期号: 10, 页码: 1327-1334
作者:  Yan Zhong;  Xian Aiping
收藏  |  浏览/下载：89/0  |  提交时间：2021/02/02
Sn-0.7Cu  pitting corrosion  salt spray corrosion  lead-free solder