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| Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者: M. N. Wang; J. Q. Wang; W. Ke
  收藏 | 浏览/下载：116/0 | 提交时间：2014/04/18
Lead-free Solders 3.5-percent Nacl Solution Electrochemical Corrosion Ga Solder Reliability Surface Alloys Joints Tin Sn |
| Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
作者: F. F. Tian; P. J. Shang; Z. Q. Liu
收藏 | 浏览/下载：196/0 | 提交时间：2014/07/03
Interfaces Intermetallic Alloys And Compounds Diffusion Kirkendall Void Snin Solder Cu Substrate Growth-kinetics Snagcu Solder Diffusion Compound Identification Ni |
| In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655
作者: M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏 | 浏览/下载：113/0 | 提交时间：2013/02/05
Lead-free Solder Microstructure Corrosion Three-point Bending Fracture Electrochemical Corrosion Behavior 3.5-percent Nacl Solution Ga Solder Alloys Sn Joints |
| Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 532, 页码: 167-177
作者: H. F. Zou; Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：118/0 | 提交时间：2013/02/05
Sn-bi Solder Void Cu3sn Bi Segregation Interfacial Embrittlement Cu Alloys Solder Interconnect Grain-boundaries Single-crystal Bismuth Embrittlement Segregation Copper Strength |
| In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2037Kb) | 收藏 | 浏览/下载：109/0 | 提交时间：2012/04/13
In Situ Observation Shear Creep-fatigue Fracture Sn-58bi Solder Grain-boundary Sliding Lead-free Solders Sn-bi Microstructure Evolution Tensile Properties Alloys Deformation Technology Metals Ag |
| In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
作者: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2667Kb) | 收藏 | 浏览/下载：80/0 | 提交时间：2012/04/13
Snag/cu Solder Joints Creep Fatigue In Situ Observation Strain Localization Grain Subdivision Lead-free Solders Pb-sn Solder Tensile Properties Shear-strength Deformation-behavior Sn-3.5ag Solder Strain-rate Ag Microstructure Alloys |
| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
作者: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P; Liu C Z
收藏 | 浏览/下载：113/0 | 提交时间：2021/02/26
SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者: P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏 | 浏览/下载：81/0 | 提交时间：2012/04/13
In Situ Tem Straining Single Crystal Sn Slip System Self-diffusion Crack Propagation Free Solder Alloys Lead-free Solders Thermal Fatigue Behavior Creep Tin Pb Joints Ag Deformation |
| Tin whisker growth on bulk Sn-Pb eutectic doping with Nd 期刊论文
Microelectronics Reliability, 2009, 卷号: 49, 期号: 6, 页码: 667-672
作者: M. Liu; A. P. Xian
Adobe PDF(530Kb) | 收藏 | 浏览/下载：100/0 | 提交时间：2012/04/13
Free Solder Alloys Surface Cu Joints |
| Spontaneous growth of tin whiskers on tin-rare-earth alloys 期刊论文
Philosophical Magazine Letters, 2007, 卷号: 87, 期号: 9, 页码: 657-662
作者: B. Jiang; A. P. Xian
收藏 | 浏览/下载：71/0 | 提交时间：2012/04/13
Solder Alloys Microstructure Wettability |
