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The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
收藏  |  浏览/下载：160/0  |  提交时间：2021/02/02
AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack  
Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 6, 页码: 852-859
作者:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
Adobe PDF(644Kb)  |  收藏  |  浏览/下载：128/0  |  提交时间：2012/04/13
Lead-free Solders  Interface  Intermetallic Compounds (Imcs)  Fatigue  Crack  Fractography  Intermetallic Compound  Deformation-behavior  Cu  Microstructure  Evolution  Growth  96.5sn-3.5ag  Temperature  Interfaces  Morphology  
Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 469, 期号: 1-2, 页码: 207-214
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(2393Kb)  |  收藏  |  浏览/下载：101/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Lead-free Solder  Intermetallic Compounds  (Imcs)  Growth Kinetics  Local Cracks  Lead-free Solders  Electroless Ni(p) Metallization  Intermetallic  Compound  Cu-sn  Joints  Ni  Bi  Nanoindentation  Microstructure  Wt.percent  
Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals 期刊论文
Acta Materialia, 2008, 卷号: 56, 期号: 11, 页码: 2649-2662
作者:  H. F. Zou;  H. J. Yang;  Z. F. Zhang
Adobe PDF(4272Kb)  |  收藏  |  浏览/下载：101/0  |  提交时间：2012/04/13
Cu Single Crystal  Orientation  Intermetallic Compounds (Imcs)  Coarsening Mechanism  Growth Kinetics  Lead-free Solders  Interfacial Reactions  Eutectic Snpb  Joints  Microstructure  Sn-3.5ag  Sn-0.7cu  Copper  
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
作者:  H. F. Zou;  Q. S. Zhu;  Z. F. Zhang
Adobe PDF(1268Kb)  |  收藏  |  浏览/下载：77/0  |  提交时间：2012/04/13
Ag Single Crystal Substrate  Sn-3.8ag-0.7cu Solder  Intermetallic  Compounds (Imcs)  Growth Kinetics  Tensile Strength  Fracture  Lead-free Solder  Interfacial Reaction  Cu-substrate  Microstructure  Metallization  Sn-3.5ag  Bump  Ni  Strength  Pb  
Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07. 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 卷号: 435, 页码: 588-594
作者:  Zhu, Q. S.;  Zhang, Z. F.;  Shang, J. K.;  Wang, Z. G.
收藏  |  浏览/下载：77/0  |  提交时间：2021/02/02
Sn-Ag-Cu solder  copper single crystal  intermetallic compounds (IMCs)  interface  cyclic deformation  persistent slip bands (PSBs)  fatigue cracking  
Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2006, 卷号: 435, 页码: 588-594
作者:  Q. S. Zhu;  Z. F. Zhang;  J. K. Shang;  Z. Wang
收藏  |  浏览/下载：123/0  |  提交时间：2012/04/14
Sn-ag-cu Solder  Copper Single Crystal  Intermetallic Compounds (Imcs)  Interface  Cyclic Deformation  Persistent Slip Bands (Psbs)  Fatigue  Cracking  Persistent Slip Bands  Pb-free Solders  Intermetallic Compounds  Cyclic  Deformation  Joints  Behavior  Growth  Microstructure  Evolution  Strength