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Crack suppression in electrodeposited brass film through controlling growth stresses by co-depositing with Bi 期刊论文
THIN SOLID FILMS, 2023, 卷号: 777, 页码: 9
作者:  Li, Ronghui;  Guan, Yishan;  Fan, Qinna
收藏  |  浏览/下载：7/0  |  提交时间：2024/01/07
Growth stress  Brass  Thin film  Bismuth  Stacking faults  Cracking  Crack free  Electrodeposition  
Shear Band Evolution under Cyclic Loading and Fatigue Property in Metallic Glasses: A Brief Review 期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 13, 页码: 18
作者:  Wang, Xiaodi;  Wu, Shaojie;  Qu, Ruitao;  Zhang, Zhefeng
收藏  |  浏览/下载：139/0  |  提交时间：2021/10/15
metallic glass  shear band  fatigue property  fatigue crack  free volume  
Fatigue behavior of a Ti-based metallic glass: Effect of sampling location in association with free volume 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 861, 页码: 10
作者:  Wang, X. D.;  Song, S. L.;  Zhu, Z. W.;  Zhang, H. F.;  Ren, X. C.
收藏  |  浏览/下载：177/0  |  提交时间：2021/10/15
Metallic glass  Shear band  Sampling location  Free volume  Fatigue endurance limit  Fatigue crack  
Fatigue behavior of a Ti-based metallic glass: Effect of sampling location in association with free volume 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 861, 页码: 10
作者:  Wang, X. D.;  Song, S. L.;  Zhu, Z. W.;  Zhang, H. F.;  Ren, X. C.
收藏  |  浏览/下载：146/0  |  提交时间：2021/10/15
Metallic glass  Shear band  Sampling location  Free volume  Fatigue endurance limit  Fatigue crack  
Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
收藏  |  浏览/下载：196/0  |  提交时间：2021/02/02
Lead-free solder  reliability  IMC  crack  failure  
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494
作者:  C. Chen;  L. Zhang;  J. X. Zhao;  L. H. Cao;  J. K. Shang
收藏  |  浏览/下载：178/0  |  提交时间：2013/02/05
Solder  Size Effect  Shear Strength  Microstructure  Lead-free Solder  Fatigue-crack Initiation  Sn-ag  Fe-42ni  Ni  Cu  
Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2012/04/13
Crack-growth-behavior  Lead-free Solders  Alpha-al2o3(0001)/cu(111)  Interface  Mechanical Strength  Reactive Interface  Molecular-dynamics  Joints  Cu3sn  Cu  1st-principles  
Application of the extended traction boundary element-free method to the fracture of two-dimensional infinite magnetoelectroelastic solid 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2011, 卷号: 54, 期号: 6, 页码: 1141-1153
作者:  Feng WenJie;  Li YanSong;  Han Xu;  Xu ZengHe
收藏  |  浏览/下载：100/0  |  提交时间：2021/02/02
GREENS-FUNCTIONS  POTENTIAL PROBLEMS  NODE METHOD  PIEZOMAGNETIC PHASES  COMPOSITE-MATERIALS  ELLIPTIC CAVITY  CURVED CRACKS  ELASTICITY  MESHLESS  MEDIA  boundary element-free method  boundary integral equation  radial point interpolation method  crack problem  magnetoelectroelastic materials  
Application of the extended traction boundary element-free method to the fracture of two-dimensional infinite magnetoelectroelastic solid 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2011, 卷号: 54, 期号: 6, 页码: 1141-1153
作者:  Feng WenJie;  Li YanSong;  Han Xu;  Xu ZengHe
收藏  |  浏览/下载：156/0  |  提交时间：2021/02/02
GREENS-FUNCTIONS  POTENTIAL PROBLEMS  NODE METHOD  PIEZOMAGNETIC PHASES  COMPOSITE-MATERIALS  ELLIPTIC CAVITY  CURVED CRACKS  ELASTICITY  MESHLESS  MEDIA  boundary element-free method  boundary integral equation  radial point interpolation method  crack problem  magnetoelectroelastic materials  
Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
作者:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
收藏  |  浏览/下载：80/0  |  提交时间：2012/04/13
In Situ Tem  Straining  Single Crystal Sn  Slip System  Self-diffusion  Crack Propagation  Free Solder Alloys  Lead-free Solders  Thermal Fatigue  Behavior  Creep  Tin  Pb  Joints  Ag  Deformation