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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
作者:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
收藏  |  浏览/下载：143/0  |  提交时间：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：108/0  |  提交时间：2013/12/24
Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1143-1147
作者:  W. Liu;  L. Zhang;  K. J. Hsia;  J. K. Shang
Adobe PDF(773Kb)  |  收藏  |  浏览/下载：71/0  |  提交时间：2012/04/13
Wetting  Reactive Wetting  Spreading  Solder  Thin Film Pattern  Liquid  Film  Morphological Wetting Transitions  Structured Surfaces  Eutectic Snpb  Films  
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect 期刊论文
Journal of Electronic Materials, 2009, 卷号: 38, 期号: 3, 页码: 425-429
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(363Kb)  |  收藏  |  浏览/下载：84/0  |  提交时间：2012/04/13
Electromigration  Coupling Effect  Polarity  Intermetallic Compound  Interfacial Reaction  Zn Based Solders  Ni-p/au Layer  Cross-interaction  Intermetallic  Compounds  Bump Metallization  Eutectic Snpb  Sn-9zn Solder  Cu  Joints  Combination  
Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文
Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(797Kb)  |  收藏  |  浏览/下载：129/0  |  提交时间：2012/04/13
Sn-ag-zn  Lead-free Solder  Gravity  Interfaces  Intermetallic Compounds  Lead-free Solders  Cu Substrate  Bump Metallization  Tensile Properties  Phase-equilibria  Eutectic Alloy  Ni  Behavior  Bi  Microstructure  
Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文
Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227
作者:  J. K. Shang;  Q. L. Zeng;  L. Zhang;  Q. S. Zhu
收藏  |  浏览/下载：96/0  |  提交时间：2012/04/13
Low-cycle Fatigue  Lead-free Solders  Crack-growth-behavior  Thermal  Fatigue  63sn-37pb Solder  Eutectic Solder  Thermomechanical Fatigue  Ag-cu  Joints  Life  
Bi segregation at interface of the eutectic SnBi/Cu solder joint 期刊论文
ACTA METALLURGICA SINICA, 2005, 卷号: 41, 期号: 8, 页码: 847-852
作者:  Liu, CZ;  Zhang, W;  Sui, ML;  Shang, JK
收藏  |  浏览/下载：91/0  |  提交时间：2021/02/02
eutectic SnBi/Cu solder joint  segregation  interfacial reaction  Pb-free solder  
Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect 期刊论文
Journal of Electronic Materials, 2005, 卷号: 34, 期号: 11, 页码: 1363-1367
作者:  Q. L. Yang;  J. K. Shang
收藏  |  浏览/下载：73/0  |  提交时间：2012/04/14
Electromigration  Solder  Interconnect  Interface  Eutectic Snpb  Electromigration