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| Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890
作者: Sun FuLong; Gao LiYin; Liu ZhiQuan; Zhang Hao; Sugahara Tohru; Nagao Shijo; Suganuma Katsuaki
  收藏 | 浏览/下载：146/0 | 提交时间：2021/02/02
NI SOLDER JOINTS NANO-SCALE TWINS INTERFACIAL RELIABILITY FE-NI COPPER METALS DEFORMATION STRENGTH DEPENDENCE BOUNDARIES Electrodeposition Nanotwinned Cu Growth mechanism Acid adsorption |
| Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
作者: M. N. Wang; J. Q. Wang; W. Ke
收藏 | 浏览/下载：116/0 | 提交时间：2014/04/18
Lead-free Solders 3.5-percent Nacl Solution Electrochemical Corrosion Ga Solder Reliability Surface Alloys Joints Tin Sn |
| Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者: L. M. Yang; Z. F. Zhang
收藏 | 浏览/下载：111/0 | 提交时间：2013/12/24
Lead-free Solder Intermetallic Compounds Interfacial Reaction Grain Growth Sn-ag-cu Shear-strength Mechanical-properties Rare-earth Bga Joints Alloy Electromigration Reliability |
| Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
作者: Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：108/0 | 提交时间：2013/12/24
Sn-ag/cu Solder Joints Thermal Fatigue Strain Localization Grain Rotation Dynamic Recovery Stress-relaxation Behavior Eutectic Sn-3.5ag Solder Lead-free Solders Pb-free Solders Sn-ag Tensile Properties Shear-strength Fracture-behavior Deformation Creep |
| The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy 期刊论文
Journal of Alloys and Compounds, 2013, 卷号: 550, 页码: 231-238
作者: C. F. Li; Z. Q. Liu; J. K. Shang
收藏 | 浏览/下载：119/0 | 提交时间：2013/12/24
Tin Whisker Hillock Ndsn3 Oxidation Growth Mechanism Lead-free Solder Electron-microscopy Nd Addition Sn-whiskers Joints Mechanisms |
| Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文
Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216
作者: H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang
收藏 | 浏览/下载：100/0 | 提交时间：2013/12/24
Intermetallic Compound Formation Sn-3.8ag-0.7cu Solder Cu Microstructure Joints |
| In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2012, 卷号: 558, 页码: 649-655
作者: M. N. Wang; J. Q. Wang; H. Feng; W. Ke
收藏 | 浏览/下载：112/0 | 提交时间：2013/02/05
Lead-free Solder Microstructure Corrosion Three-point Bending Fracture Electrochemical Corrosion Behavior 3.5-percent Nacl Solution Ga Solder Alloys Sn Joints |
| Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 4, 页码: 741-747
作者: Q. S. Zhu; H. Y. Liu; Z. G. Wang; J. K. Shang
收藏 | 浏览/下载：111/0 | 提交时间：2013/02/05
Solder Interconnect Electromigration Hillock Grain Boundary Groove Joints Electromigration Whisker Copper Tin Cu |
| Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
作者: L. M. Yang; Q. K. Zhang; Z. F. Zhang
收藏 | 浏览/下载：88/0 | 提交时间：2013/02/05
Solder Joint Interfaces Intermetallic Compounds Fracture Shear Strength Lead-free Solder Brazed Joints Size Sn Microstructure Deformation Reliability Failure Copper Cu |
| Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 11, 页码: 3161-3168
作者: H. F. Zhou; J. D. Guo; J. K. Shang
收藏 | 浏览/下载：99/0 | 提交时间：2013/02/05
Electroless Fe-ni Under-bump Metallization Interfacial Reaction Lead-free Solders Wetting Balance Snagcu Solder Cu Joints Solderability Growth Ag |
