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Identifying atomically thin isolated-band channels for intrinsic steep-slope transistors by high-throughput study 期刊论文
SCIENCE BULLETIN, 2024, 卷号: 69, 期号: 10, 页码: 1427-1436
作者:  Qu, Hengze;  Zhang, Shengli;  Cao, Jiang;  Wu, Zhenhua;  Chai, Yang;  Li, Weisheng;  Li, Lain-Jong;  Ren, Wencai;  Wang, Xinran;  Zeng, Haibo
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
2D materials  Electronic band structures  Transport properties  Steep-slope transistors  DFT-NEGF calculations  
Dislocation exhaustion and ultra-hardening of nanograined metals by phase transformation at grain boundaries 期刊论文
NATURE COMMUNICATIONS, 2022, 卷号: 13, 期号: 1, 页码: 8
作者:  Wu, Shangshu;  Kou, Zongde;  Lai, Qingquan;  Lan, Si;  Katnagallu, Shyam Swaroop;  Hahn, Horst;  Taheriniya, Shabnam;  Wilde, Gerhard;  Gleiter, Herbert;  Feng, Tao
收藏  |  浏览/下载：27/0  |  提交时间：2023/05/09
Dislocation exhaustion and ultra-hardening of nanograined metals by phase transformation at grain boundaries 期刊论文
NATURE COMMUNICATIONS, 2022, 卷号: 13, 期号: 1, 页码: 8
作者:  Wu, Shangshu;  Kou, Zongde;  Lai, Qingquan;  Lan, Si;  Katnagallu, Shyam Swaroop;  Hahn, Horst;  Taheriniya, Shabnam;  Wilde, Gerhard;  Gleiter, Herbert;  Feng, Tao
收藏  |  浏览/下载：31/0  |  提交时间：2023/05/09
Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
收藏  |  浏览/下载：196/0  |  提交时间：2021/02/02
Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：293/0  |  提交时间：2021/02/02
Sn-Cu  microstructures  IMC  mechanical properties  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
收藏  |  浏览/下载：127/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
收藏  |  浏览/下载：134/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
收藏  |  浏览/下载：154/0  |  提交时间：2021/02/02
Materials, processing and reliability of low temperature bonding in 3D chip stacking 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:  Zhang, Liang;  Liu, Zhi-quan;  Chen, Sinn-Wen;  Wang, Yao-dong;  Long, Wei-Min;  Guo, Yong-huan;  Wang, Song-quan;  Ye, Guo;  Liu, Wen-yi
收藏  |  浏览/下载：127/0  |  提交时间：2021/02/02
3D IC  Low temperature bonding  Bonding method  Reliability  
Properties and Microstructures of Sn-Bi-X Lead-Free Solders 期刊论文
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2016, 页码: 15
作者:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su-juan;  Ma, Jia;  Bao, Li
收藏  |  浏览/下载：96/0  |  提交时间：2021/02/02